STATS ChipPAC Honoured With Second Consecutive Supplier of the Year Award From Cirrus Logic

SINGAPORE -- 6 DECEMBER 2012, UNITED STATES--(Marketwire - Dec 5, 2012) -  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced that for the second consecutive year it has been honoured with the "Supplier of the Year" award from Cirrus Logic, Inc. (NASDAQ: CRUS), a leader in high-precision, analog and mixed-signal processing components.

"Cirrus Logic has been on a sharp growth trajectory in 2012, and STATS ChipPAC has continuously demonstrated its ability to deliver exceptional manufacturing performance, quality and responsiveness," said Randy Carlson, Vice President of Supply Chain Management. "Their superior teamwork has allowed Cirrus to effectively and consistently deliver new products to the market and quickly ramp production volume to meet our customers' expectations."

Cirrus Logic's innovative mixed-signal audio products can be found in a wide range of consumer applications, such as portable media players, smartphones and tablets, and the company's new-generation of LED controllers is setting the standard for dimmer compatibility. STATS ChipPAC provides advanced wafer level packaging and test services for Cirrus Logic's fastest growing portable audio solutions. 

"We share Cirrus Logic's commitment to performance and innovation, and are very proud to be recognised as their Supplier of the Year for the second year in a row. STATS ChipPAC's technology leadership in mobility solutions, proven manufacturing excellence and integrated turnkey solutions provide our customers with a sustained competitive edge in the market," said Hal Lasky, Executive Vice President and Chief Sales Officer, STATS ChipPAC. "It has been our honour to support Cirrus Logic as they continue to build on their leadership and success in portable audio devices for smartphones and mobile consumer electronics."

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.