SMART Introduces New Memory Module Form Factor With Industry's First Module-in-a-Package(TM) (MIP(TM))

NEWARK, CA--(Marketwired - Dec 10, 2013) - SMART Modular Technologies, Inc., a leading independent designer, manufacturer and supplier of value added subsystems including memory modules, flash memory cards and other solid state storage products, today announced MIP, the industry's first module-in-a-package memory form factor. SMART's innovative tiny form factor design is targeted for broadcast video, mobile router, high-end video/graphics cards and embedded computing applications where power consumption, performance and space limitations are of principle concern. 

While SMART's MIP occupies just one-fifth the area of an SO-DIMM, it offers higher performance and consumes less power. Key improvements with MIP include 42% power savings, 42% jitter reduction, and 39% PK/PK savings. Being a "soldered down" module, unlike an SO-DIMM, the need for a mating connector is eliminated with MIP. SMART's MIP supports both, applications requiring ECC and the ones that do not. These are key benefits for applications where memory capacity in a small space is critical. And unlike other DRAM down-board usage scenarios, the MIP contains on-package address and CNTRL termination.

SMART's MIP is an ideal memory solution for the emergence of new cube computing applications in networking, telecom and computing segments, as it leverages SMART's long-term, off-the-shelf stacking expertise. Offered in 2GB and 4GB densities, the MIP runs at speeds up to DDR3-2133.

"SMART has been stacking off-the-shelf DRAMs for many years providing key space-saving benefits to OEMs," stated Mike Rubino, SMART's Vice President of Engineering. "The MIP is a natural extension of this expertise furthering SMART's commitment to deliver high quality, high reliability unique memory solutions."

SMART will be showcasing its new MIP at the Embedded World 2014 Exhibition & Conference in Nuremburg, Germany at stand 4-360 starting on February 25, 2014.

About SMART Modular Technologies
SMART Modular is a technology leader in the design, development and deployment of current and next-generation memory and storage products. Combining leading-edge design and manufacturing with proven world-class support, SMART Modular leverages its deep expertise in DRAM, SRAM and Flash architectures, with world-class board-layout design. SMART Modular delivers high-quality, high-reliability solutions to a broad customer base, including tier one computing and telecom OEMs as well as industrial, medical and automotive customers. In support of these designs, SMART Modular provides award-winning innovations in memory and embedded storage technologies. SMART Modular is part of the SMART family of global companies. See www.smartm.com for more information.

About SMART Worldwide Holdings
The SMART family of companies are leading designers, manufacturers and suppliers of electronic subsystems for the most demanding OEMs around the world. The SMART companies have led the way over the past 25 years providing standard and custom products to today's leading global OEMs crossing all major electronic industries. These industries include PC, enterprise and industrial servers, networking, telecom, defense, aerospace, gaming and embedded application markets. Taking innovations from the design stage through manufacturing and delivery, SMART Modular Technologies has developed a comprehensive product line that includes DRAM, SRAM, and Flash memory in various form factors. SMART High Reliability Solutions offers high-performance, high-capacity solid state drives ("SSDs") for defense, aerospace and industrial automation markets. SMART's presence in the U.S., Europe, Asia and Latin America enables it to provide its customers with proven expertise in international logistics, asset management and supply-chain management worldwide. See www.smartm.com for more information.