NEW YORK, Nov. 26, 2018 (GLOBE NEWSWIRE) -- The global printed circuit board (PCB) market was valued at USD 63.1 billion in 2017 and is expected to reach USD 76.9 billion by 2024, at a CAGR of 3.1%. Factors driving the growth of the market are; rising adoption of automation in various end-user industries, growing demand for wireless devices, increasing miniaturization of devices, surging need for more efficient interconnect solutions, and increasing demand for flexible circuits. Owing to the implementation of processors and sensors in smart gadgets, the size of the PCB has reduced to 74% approximately. Additionally, usage of flame retardant chemicals in PCBs to ensure fire safety, and increasing capital investment is further augmenting the market growth. Moreover, huge growth in the PCB market is also due to the increasing demand for smart tablets and smart phones in IT and consumer electronics sector. Growth in wearable electronics is emerging as a key opportunity in the PCB market.
Printed Circuit Board is a circuit board made up of laminated material (Cu) that offers the interconnection for electronic components and integrated circuits. To place electronic components in an insulated board, holes are created with the help of drillers. To maintain the component’s stability in a circuit board, they are soldered on the board, and are then connected through copper tracks. PCBs are used to electrically connect the components and provide a base on which the entire system can be integrated.
Growing awareness regarding environmental friendly printed circuit board
Advancements in technology have led to an increased number of new electronic products in the market, and the trend is likely to continue in the coming years. However, massive production of PCBs is becoming unfriendly to environment, due to the usage of wet chemicals in their manufacturing. Moreover, lack of recycling ability also affecting the adoption rate of printed circuit boards. To ensure less toxic emissions into the environment, ink jet printing technology is used in the manufacturing of PCBs. This technology enables the cost-effective manufacturing of thin, flexible and disposable electrical devices.
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Global Printed Circuit Board (PCB) Market – Regional Insight
Asia-Pacific held the largest market share of the global PCB market in 2017, with around 77% of the market share. The growth in APAC is attributed to the presence of many semi-conductor manufacturers, and growing adoption of smart devices in the region. North America held the second largest share of the global market in 2017, owing to the high demand from military and aerospace sector.
Key findings from the report:
- Based on type, multi-layer PCB dominated the global PCB market in 2017, and is expected to grow at the fastest rate during the forecast period.
- On the basis of substrate type, HDI segment held the major market share. Rigid-flex printed circuit board is likely to register the highest CAGR during 2017-2024, owing to the increasing demand for display applications and rising adoption of smart phones.
- Based on PCB laminate Type, FR-4 dominates the global PCB market share in terms of value. This material provides a cost effective and reliable solution for the various designs.
- On the basis of end-use, communication segment held the major market share in 2017, owing to the increasing adoption of digital devices such as mobiles, networking equipment, power distribution system, amplifiers routers, etc. Automotive segment is expected to grow at the fastest rate during the forecast period.
- Key players are AT&S; Nippon Mektron, Ltd.; Unimicron Corp.; Samsung Electro-mechanics.; Dynamic Electronics Co., Ltd.; Daeduck Electronics Co., Ltd.; CMK Corporation; Nan Ya PCB Co., Ltd.; TTM Technologies;Interflex Co., Ltd.; among others.
The report segments the global printed circuit board market on the basis of type, substrate type, components, PCB laminate type, laminate material type, end-use, and region.
By Type
- Single-sided
- Double-sided
- Multi-layer
By Substrate Type
- Rigid 1-2 sided
- Standard multilayer
- High-Density Interconnect (HDI)
- IC substrate
- Flexible circuits
- Rigid-flex
- Others
By Components
- Diodes
- Capacitors
- Resistors
- Integrated Circuits
- Others
By PCB Laminate Type
- Paper
- FR-4
- CEM
- Polyimide
- Others
By Laminate Material Type
- Glass Fabric
- Epoxy Resin
- Kraft Paper
- Phenolic Resin
By End-Use
- Consumer Electronics
- IT & Telecommunication
- Communication
- Aerospace and Defense
- Automotive
- Industrial Electronics
- Healthcare
- Others
By Region
- North America
º U.S.
º Canada
º Mexico - Europe
º UK
º Germany
º France
º Italy
º Rest of Europe - Asia-Pacific (APAC)
º China
º Japan
º India
º South Korea
º Rest of APAC - Middle East and Africa
º UAE
º South Africa
º Rest of Middle East and Africa - Central and South America
º Brazil
º Rest of Central and South America
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