Dublin, Oct. 12, 2020 (GLOBE NEWSWIRE) -- The "Thin Wafer Market with COVID-19 Impact analysis by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology , Application, and Geography - Global Forecast to 2025" report has been added to ResearchAndMarkets.com's offering.
The global thin wafer market is estimated to grow from USD 7.6 billion in 2020 to USD 10.8 billion by 2025, at a CAGR of 7.2%.
The market has a promising growth potential due to several factors, including the increased demand for connected devices owning to advancements in IoT, rising adoption of MEMS technology in portable health monitoring devices, increasing utilization of thin wafers in automotive communication and safety systems, miniaturization of electronic devices, and high amount of material saving.
COVID-19 sent both demand-side and supply-side shocks across the global economy. Leading thin wafer providers, such as GlobalWafers Co., Ltd. (Taiwan) and Siltronic (Germany), have incurred significant losses owing to the pandemic. Both companies have reported a decline of approximately 10% and 6% respectively in their half-year revenue as compared to the previous year. Also, devices such as MEMS, CIS, memory, RF devices, LEDs, interposers, and logic have experienced a decline in demand from end-user industries such as consumer electronics, automotive, industrial, and medical. This has resulted in a decline in the demand for thin wafers, further weakening the financial position of most of the key manufacturers.
Polishing: The fastest-growing technology segment of the thin wafer market.
The wafer polishing process creates thinner wafers than back-grinding alone and evens out any irregular topography and prevents warping that causes the wafers to weaken. The integration of RFIDs into various consumer electronic devices and identity solutions, such as smart cards and identification tags, demands thinner wafers with smooth surfaces to be able to be incorporated seamlessly into these devices. This is expected to boost the demand for wafer polishing equipment during the forecast period.
Memory: The largest growing segment of thin wafer market, by application.
The memory segment accounted for the largest market share of the thin wafer market, by application and is dominated by smartphone manufacturers. New memory technologies such as dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), and flash memory (NAND) have replaced traditional technologies. Moreover, memory devices require high-precision bonding and packaging for the best performance. This shift in the memory market has created a demand for thinner wafers to integrate memory chips easily into various consumer electronic devices.
APAC is projected to be the fastest geographical market between 2020 and 2025
APAC is expected to grow at the highest CAGR between 2020 and 2025. The high growth rate of APAC is attributed to the growing adoption of connected devices and increasing demand for wearable electronics during the forecast period. The rising number of users of smartphones and consumer devices due to growing disposable incomes is likely to stimulate the thin wafer market growth in APAC. Additionally, an increasing number of IDMs in the region is expected to boost the demand for thin wafers in the region.
Key Topics Covered:
1 Introduction
2 Research Methodology
3 Executive Summary
4 Premium Insights
4.1 Attractive Growth Opportunities in Thin Wafer Market
4.2 Wafer Thinning Equipment Market, by Technology
4.3 Thin Wafer Market, by Application
4.4 Wafer Thinning Equipment Market, by Technology and Application
4.5 Geographical Analysis of Thin Wafer Market
5 Market Overview
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Rising Adoption of Mems Technology in Portable Health Monitoring Devices
5.2.1.2 Increasing Focus on E-Learning Amid COVID-19 Drives Demand for Smartphones, Tablets, Laptops, and Telecommunication Systems
5.2.1.3 Reducing Sizes of Electronic Devices
5.2.1.4 Growing Smartphone and Consumer Electronics Markets
5.2.1.5 High Amount of Material Saving
5.2.2 Restraints
5.2.2.1 Efficiency Maintenance - Major Issue for Thin Wafers
5.2.3 Opportunities
5.2.3.1 Expanding IC Industry in China
5.2.3.2 Growing Adoption of IoT and Ai in Automotive Sector
5.2.3.3 Rising Adoption of Portable Devices
5.2.4 Challenges
5.2.4.1 Thin Wafers Being Volatile and Susceptible to Damage Caused by Pressure or Stress
5.2.4.2 Delay of Investment Plans for Capacity Expansion by Wafer Manufacturers due to COVID-19
5.3 Average Selling Price Trend
5.4 Regulatory Update
5.5 Value Chain Analysis
5.6 Market Map
5.7 Technology Analysis
5.7.1 Silicon Carbide (SIC) Technology
5.8 Case Study Analysis
5.8.1 Stmicroelectronics Select Cree's Silicon Carbide Bare and Epitaxial Wafers
5.8.2 Infineon Technologies and Umc Announce Manufacturing Agreement
6 Thin Wafer Market, by Process
6.1 Introduction
6.2 Temporary Bonding & Debonding
6.2.1 Market Adhesives
6.2.1.1 Uv-Release Adhesives
6.2.1.2 Thermal-Release Adhesives
6.2.1.3 Solvent-Release Adhesives
6.3 Carrier-Less Approach (Taiko Process)
7 Thin Wafer Market, by Wafer Size
7.1 Introduction
7.2 125 mm
7.2.1 Market for 125 mm Wafers to be Impacted due to Growing Adoption of Larger Diameter Wafers by Semiconductor Manufacturers
7.3 200 mm
7.3.1 Demand for 200 mm Wafers to Witness a Steady Growth During the Forecast Period
7.4 300 mm
7.4.1 300 mm Wafer Market Expected to Witness Highest Growth Rate During the Forecast Period
8 Thin Wafer Market, by Application
8.1 Introduction
8.2 Mems
8.2.1 Growth of Mems is Attributed to Its Huge Adoption in Portable Electronic Devices
8.3 CIS
8.3.1 Increasing Demand for CIS from Automotive Vertical is Expected to Drive the Demand
8.4 Memory
8.4.1 Growing Adoption of Nand Flash Memory in Mobile Electronics to Drive the Demand
8.5 RF Devices
8.5.1 Growing Adoption of RF Devices in Smartphones to Propel the Market Growth During the Forecast Period
8.6 LED
8.6.1 Increasing Demand for LED Components in Home and Infrastructure Market to Augment the Growth During the Forecast Period
8.7 Interposers
8.7.1 Requirement for Advanced Architecture in Miniature Electronic Devices to Drive the Demand
8.8 Logic
8.8.1 High Penetration of Affordable Cloud Computing Solutions to Drive the Demand for Logic Devices
8.9 Others
8.10 Most Negatively Impacted Industry by COVID-19
8.10.1 RF Devices
8.10.1.1 Impact Analysis
8.11 Least Impacted Industry by COVID-19
8.11.1 LED
8.11.1.1 Impact Analysis
9 Thin Wafer Market, by Technology
9.1 Introduction
9.2 Wafer Grinding
9.2.1 Wafer Grinding Process is Attracting Manufacturers due to Its Promising Application in the Miniaturization and Packaging of Semiconductor Devices
9.3 Wafer Polishing
9.3.1 Demand for Thin Wafers with Smooth Surface for Seamless Integration to Drive the Demand for Wafer Polishing Equipment
9.4 Wafer Dicing
9.4.1 Wafer Dicing Equipment Market to Account for the Largest Market Share During the Forecast Period
10 Thin Wafer Market, by Geography
10.1 Introduction
10.2 Americas
10.2.1 Impact of COVID-19 on Thin Wafer Market in Americas
10.3 EMEA
10.4 APAC
11 Competitive Landscape
11.1 Competitive Landscape Overview
11.2 Market Share Analysis of Key Companies, 2019
11.3 Competitive Situation and Trends
11.3.1 Product Launches
11.3.2 Agreements, Collaborations, and Contracts
11.3.3 Expansions and Mergers & Acquisitions
11.4 Thin Wafer Market, Company Evaluation Matrix, 2019
11.4.1 Star
11.4.2 Pervasive
11.4.3 Participant
11.4.4 Emerging Leader
11.5 Strength of Product Portfolio
11.6 Business Strategy Excellence
12 Company Profiles
12.1 Introduction
12.2 Key Players
12.2.1 SK Siltron
12.2.2 Shin-Etsu Chemical Co., Ltd.
12.2.3 Siltronic
12.2.4 Sumco Corporation
12.2.5 Globalwafers Co., Ltd.
12.2.6 Suss Microtec
12.2.7 Lintec Corporation
12.2.8 Disco Corporation
12.2.9 3M
12.2.10 Applied Materials
12.3 Five Year Revenue Analysis of Major Players in the Thin Wafer Market
12.4 Right to Win
12.5 Other Companies
12.5.1 Nissan Chemical Corporation
12.5.2 Mechatronic Systemtechnik
12.5.3 Synova
12.5.4 EV Group
12.5.5 Brewer Science
12.5.6 Ulvac GmbH
12.5.7 Wafer Works Corporation
12.5.8 Okmetic
12.5.9 Atecom Technology Co., Ltd.
12.5.10 Siltronix Silicon Technologies
13 Appendix
13.1 Insights of Industry Experts
13.2 Discussion Guide
13.3 Knowledge Store: Subscription Portal
13.4 Available Customizations
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