Seoul, South Korea, July 12, 2022 (GLOBE NEWSWIRE) -- United States, Rockville MD: According to Fact.MR, a market research and competitive intelligence provider, the global low-cure stress adhesives market is estimated at US$ 252.3 million in 2022 and is expected to expand at an impressive CAGR of 9% during the forecast years of 2022-2032.
Low-cure stress adhesives are applied to either one or both of the materials that need to be bonded. The primary use of these adhesives is in automotive, healthcare, electronics, and other applications. The low-cure stress adhesives market is growing rapidly owing to the specific attributes of these adhesives, such as high reliability, gap filling & fast curing process, thermal stability, and many more other features.
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The global adhesives market stood at US$ 60 billion in FY 2021, which is expected to witness significant growth at 5% CAGR over the decade. Low-cure stress adhesives are commonly used in various applications such as fibre-optic electronics, photonics, and others. The market is also seeing growing in healthcare & medical devices and aerospace & defence.
Overall, the global low-cure stress adhesives market is expected to grow 2.4X by 2032.
What’s Driving Demand for Low-cure Stress Adhesives?
“Growing Integration of Low-cure Stress Adhesives in Packaging Industry”
Industrial technologies are evolving at a rapid pace, faster than ever before. The packaging industry is growing fast, where the need for the right low-stress adhesives for MEMS packaging has gained traction among electronic device manufacturers.
End users such as consumer electronics, automation & robotics, healthcare & medical devices, aerospace & defense, automotive, chemicals & petrochemicals, and others make high use of adhesives for the packaging of components. Low-cure stress adhesives are highly sought-after for this purpose, which is driving target market growth.
“Specific Benefits of Low-cure Stress Adhesives Opening New Doors for Sellers”
An upsurge in the number of applications and manufacturing activities has completely changed the low-cure stress adhesives market in the last few years. Leading market players developed setups for the healthcare industry for vaccine and medicine development during the global pandemic. Increasing demand and lower supply created a pressure space where the cost of production rose and squeezed the price elasticity of demand.
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Key Segments Covered in the Low-cure Stress Adhesives Industry Survey
- Low-cure Stress Adhesives Market by Substrate :
- Silicon
- Glass
- Metal
- Others
- Silicon
- Low-cure Stress Adhesives Market by Packaging :
- Cans
- Jars & Bottles
- Cartridges
- Syringes
- Cans
- Low-cure Stress Adhesives Market by Application :
- Optical
- Electro-optical
- Electronic
- Fiber-Optics
- Photonics
- Others
- Optical
- Low-cure Stress Adhesives Market by End Use :
- Consumer Electronics
- Automation & Robotics
- Healthcare & Medical Devices
- Aerospace & Defense
- Automotive
- Chemicals & Petrochemicals
- Laboratory & Research
- Others
- Consumer Electronics
- Low-cure Stress Adhesives Market by Sales Channel :
- OEM
- Aftermarket
- OEM
Competitive Landscape
Prominent low-cure stress adhesive manufacturers are Appli-Tec Inc, Chase Corporation, Dow, Dymax, Henkel Corporation, Inseto, Masterbond, Nextgen Adhesives, Norland Products, Panacol-Elosol GmbH, Parson Adhesives Inc, Tex Year Industries Inc, Toagosei Co Ltd, United Adhesives, and Zymet.
Moreover, resource channelization for planning, designing, and providing low-cure stress adhesives are crucial marketing strategies.
- In February 2021, Appli-Tec delivered its first Appli-Thane 7300 adhesive material, which is the best-in-class for thermal conductivity.
- In May 2022, Dow introduced the DOWSIL 6015 thermally conductive encapsulant, which provides exceptional thermal management for power electronic applications.
- In November 2021, Dymax, a leading manufacturer of curing materials and equipment, introduced its new adhesive 9501-F for electric vehicle battery assemblies.
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Key players in Low-cure Stress Adhesives Market
- Appli-Tec Inc
- Chase Corporation
- Dow
- Dymax
- Henkel Corporation
- Inseto
- Masterbond
- Nextgen Adhesives
- Norland Products
Key Takeaways from Low-cure Stress Adhesives Market Study
- The global low-cure stress adhesives market is projected to expand at an impressive CAGR of 9% and be valued at US$ 596.7 million by 2032.
- The market witnessed 2.2% CAGR over the period of 2017-2021.
- Under the substrate segment, silicon low-cure stress adhesives dominate the market with a valuation of US$ 175.6 million in 2022.
- Electronics, under the application segment, dominated the market with 36.8% market share in 2021.
- Consumer electronics, under end-use industry, is likely to represent 35.9% market share in 2022.
- Based on region, demand for low-cure stress adhesives is expected to increase at CAGRs of 10.7% and 7.6% in East Asia and North America, respectively.
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