Vancouver, Nov. 30, 2023 (GLOBE NEWSWIRE) -- The global die attach materials market size was USD 1.45 Billion in 2022 and is expected to register a revenue CAGR of 5.3% during the forecast period to the latest analysis by Emergen Research.
Rising demand from the semiconductor industry is a major factor driving revenue growth of the market. The semiconductor sector is currently witnessing substantial growth, driven by technological advancements that have made high-end electronic devices more accessible to the general public. This, in turn, is driving revenue growth of the die attach materials market. Over recent decades, electronic products have undergone a significant size reduction, resulting in more compact, lightweight, and portable devices.
Furthermore, the shift from analog to digital technology has made electronic devices more cost-effective. Consequently, there has been a notable rise in the demand for consumer electronic products such as smartphones, tablets, Personal Computers (PCs), wearables, augmented and virtual reality devices, consumer appliances, and various other electronics. Moreover, the proliferation of wireless connectivity technologies such as Wi-Fi, Bluetooth, 5G networks, and others has contributed to an increased need for advanced semiconductor components. In addition, the incorporation of automation across various industries has led to enhanced industrial processes, encompassing manufacturing, warehousing, industrial data management, and the adoption of industry 4.0 technologies. These developments have further driven the semiconductor industry, consequently creating a high demand for die attach materials.
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However, the worldwide COVID-19 pandemic led to the shutdown of a considerable number of factories, including those involved in the global production of electronic goods. As a consequence, there was a notable decline in the demand for die attach machines. Moreover, the semiconductor shortage brought about by the lockdowns related to the pandemic had a severe impact on the semiconductor industry, resulting in a significant setback in the progress of the die attach materials market. Factors such as volatile cost fluctuations of the vital raw materials needed for building die attach machines and shortages of crucial materials such as silicon are expected to impose limitations on revenue growth of the die attach materials market.
Scope of Research
| Report Details | Outcome |
| Market size in 2022 | USD 1.45 Billion |
| CAGR (2023–2032) | 5.3% |
| Revenue forecast to 2032 | USD 2.51 Billion |
| Base year for estimation | 2022 |
| Historical data | 2019–2021 |
| Forecast period | 2023–2032 |
| Quantitative units | Revenue in USD Billion and CAGR in % from 2023 to 2032 |
| Report coverage | Revenue forecast, company ranking, competitive landscape, growth factors, and trends |
| Segments covered | Type, technique, application, and region. |
| Regional scope | North America, Europe, Asia Pacific, Latin America, Middle East & Africa |
| Country scope | U.S., Canada, Mexico, Germany, France, U.K., Italy, Spain, Benelux, Rest of Europe, China, India, Japan, South Korea, Rest of APAC, Brazil, Rest of LATAM, Saudi Arabia, UAE, South Africa, Turkey, Rest of MEA |
| Key companies profiled | Dr. Tresky AG, Shinkawa Limited, Inseto UK Limited, Palomar Technologies, Kulicke and Soffa Industries, MicroAssembly Technologies Limited, Fasford Technology Co. Limited, Panasonic Industry Co., Ltd., ASM Pacific Technology Limited and BE Semiconductor Industries N.V |
| Customization scope | 10 hours of free customization and expert consultation |
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MAJOR COMPANIES and Market Share Analysis
The global die attach materials market is fairly consolidated with few small and medium-sized market players accounting for the majority of revenue. Major players are deploying various strategies, entering into mergers and acquisitions, strategic agreements and contracts, developing, testing, and introducing more effective in the market. Some major players included in the market report are:
- Dr. Tresky AG
- Shinkawa Limited
- Inseto UK Limited
- Palomar Technologies
- Kulicke and Soffa Industries
- MicroAssembly Technologies Limited
- Fasford Technology Co. Limited
- Panasonic Industry Co., Ltd.
- ASM Pacific Technology Limited
- BE Semiconductor Industries N.V
Strategic Development
- In September 2021, Palomar Technologies, a renowned worldwide provider of comprehensive solutions for advanced photonics and microelectronic device packaging, introduced the 3880-II Die Bonder, which stands out for its exceptional capability to slash programming time by as much as 95%.
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Segments Covered in Report
Emergen Research has segmented the global die attach materials market on the basis of type, technique, application, and region:
- Type Outlook (Revenue, USD Billion; 2019–2032)
- Die Bonder
- Flip Chip Bonder
- Technique Outlook (Revenue, USD Billion; 2019–2032)
- Soft Solder
- Eutectic
- Epoxy
- Others
- Application Outlook (Revenue, USD Billion; 2019–2032)
- Optoelectronics
- RF & MEMS
- CMOS Image Sensors
- Logic
- LED
- Memory
- Others
- Regional Outlook (Revenue, USD Billion; 2019–2032)
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- France
- U.K.
- Italy
- Spain
- Benelux
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of APAC
- Latin America
- Brazil
- Rest of LATAM
- Middle East & Africa
- Saudi Arabia
- UAE
- South Africa
- Turkey
- Rest of MEA
- North America
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