Dublin, Jan. 29, 2024 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Polishing and Grinding Equipment Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028" report has been added to ResearchAndMarkets.com's offering.
With booming technologies and an ever-expanding electronics sector, the need for advanced semiconductor wafer polishing and grinding equipment has shot up. This report provides thorough analysis and forecasts of the semiconductor wafer polishing and grinding equipment market reflects this trend, with substantial focus on the period between 2023 to 2028.
The report underscores a comprehensive evaluation of the market, detailing how the sector has elevated to a market size of US$ 410.1 million in 2022 and predicting a surge to US$ 559.1 million by 2028. This entails a projected growth rate (CAGR) of 5.1%, propelled by burgeoning demands in the electronics arena, including laptops, smartphones, and other gadgets.
A breakdown by type reveals insightful data on the segmentation within the market:
- Semiconductor Wafer Polishing Equipment
- Semiconductor Wafer Grinding Equipment
The extensive use of such equipment by foundries, memory manufacturers, integrated device manufacturers (IDMs), and others forms the basis of the end-user market analysis.
Diving into regional markets, the report examines trends and market dynamics within:
- North America (United States, Canada)
- Asia-Pacific (China, Japan, India, South Korea, Australia, Indonesia, Others)
- Europe (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
- Latin America (Brazil, Mexico, Others)
- Middle East and Africa
The industry is innovating at a brisk pace, with notable technological breakthroughs like metal-oxide-semiconductor (MOS) and chemical-mechanical-polishing (CMP) solutions featuring prominently in current trends.
The thorough research report also delves into the strategic industry dynamics, scrutinizing key driving factors, value chains, market challenges, and the competitive landscape which features prominent industry players.
With a rapidly evolving electronics landscape, demand for semiconductor wafer polishing and grinding equipment shows no signs of slowing down, echoing the necessity for continued innovation and strategic industry collaborations.
A detailed analysis of the impact of COVID-19 on market operations is included, offering a holistic overview and aiding stakeholders in crafting informed strategies.
The report's insights highlight the pulse of a critical industry poised for substantial growth, providing valuable foresight into the market's trajectory.
Key Attributes
| Report Attribute | Details |
| No. of Pages | 139 |
| Forecast Period | 2022-2028 |
| Estimated Market Value (USD) in 2022 | $410.1 Million |
| Forecasted Market Value (USD) by 2028 | $559.1 Million |
| Compound Annual Growth Rate | 5.3% |
| Regions Covered | Global |
Companies Mentioned
- Accretech (Europe) GmbH (Tokyo Seimitsu Co. Ltd.)
- Amtech Systems Inc.
- Axus Technology
- BBS Kinmei Co. Ltd.
- Disco Corporation
- Dynavest Pte. Ltd.
- Ebara Corporation
- Gigamat Technologies Inc.
- Lapmaster Wolters GmbH (Lapmaster International LLC)
- Logitech International S.A.
- Okamoto Machine Tool Works Ltd.
- Revasum Inc.
For more information about this report visit https://www.researchandmarkets.com/r/e970ow
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