Global De-bondable Adhesives Industry Report 2024, with Case Studies on ATSP Innovations, Conagen and Lumina


Dublin, June 12, 2024 (GLOBE NEWSWIRE) -- The "Global De-bondable Adhesives Growth Opportunities" report has been added to ResearchAndMarkets.com's offering.

De-bondable adhesives are defined as adhesives that enable the disassembling of parts and components or detaching the adhesive product from the skin in healthcare applications by facilitating adhesive de-bonding on demand through the application of an external stimulus.

With the rising need for sustainable practices such as recycling and reusing materials across diverse end-use industry applications, the need to de-bond materials, components, and parts is paramount. Furthermore, temporary disassembly of components for maintenance and repair using damage-free and less tedious disassembly processes is also a growing trend. De-bondable adhesive technologies are vital enablers in achieving these industry and consumer goals.

As a result, R&D initiatives target the development of de-bonding technologies and methods, such as ultrasound, UV light, electrical, thermal, chemical, laser, and magnetic. A fast-growing consumer population is driving demand across various industries, including consumer electronics and electrical appliances, automotive and transportation, packaging, and healthcare, contributing to the robust use of
de-bondable adhesive applications.

This analysis covers the demand outlook for de-bondable adhesives across consumer electronics and electrical appliances, packaging, healthcare, automotive and transportation, construction, textiles, military, and energy and other industrial end-use applications (e.g., solar PV, wind energy, semiconductor, and industrial machinery applications combined). It also discusses the main de-bonding stimuli used, such as UV-light, thermal, electrical, chemical, magnetic, ultrasound, and laser.

The demand outlook for de-bondable adhesives is dynamic, given the growing requirements discussed for each end-use industry application, volume consumption share, global volume consumption, and revenue forecast estimates.

Company Coverage:

  • ATSP Innovations
  • Conagen, Inc.
  • Lumina

Key Topics Covered:

Growth Opportunity Analysis

  • Scope of Analysis
  • Industry Segmentation
  • Value Chain
  • De-bondable Adhesives by De-bonding Mechanism and Stimuli Used
  • Growth Drivers
  • Growth Driver Analysis
  • Growth Restraints
  • Growth Restraint Analysis
  • Summary of the Main Drivers, Restraints, and Forecast Assumption Factors
  • Growth Metrics
  • Revenue and Volume Forecast
  • Revenue and Volume Forecast Analysis
  • Average Price Forecast
  • Pricing Forecast Analysis
  • Trends by End-use Industry
  • Percent Volume by End-use Industry
  • Adhesive Product Manufacturers and End-use Applications

Case Studies:

  • Case Study - Conagen, Inc. Developing De-bondable Adhesives that Meet Diverse Industrial Applications
  • Case Study - ATSP Innovations Entering the Industry with Transferable Technology First Developed for High-tech Applications
  • Case Study - Lumina Adhesives AB Meeting the Unique Needs of the Healthcare Industry

Product Development Challenges and Opportunities

  • Developing De-bondable Adhesives for Automotive and Transportation Applications
  • Developing De-bondable Adhesives for Wind Energy
  • Developing De-bondable Adhesives for Packaging
  • Developing De-bondable Adhesives for Consumer Electronics and Electrical Appliances
  • Developing De-bondable Adhesives for Textiles

Growth Opportunity Universe

  • Growth Opportunity 1: Strategic Partnering for Technology Development and Implementation
  • Growth Opportunity 2: Inorganic and Organic Growth Strategy Implementation
  • Growth Opportunity 3: Expansion into Allied Industry Verticals Through Product and Technology Development

For more information about this report visit https://www.researchandmarkets.com/r/p93b6z

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