eSilicon to present Mastering SI/PI for Advanced Package Design at the ANSYS Innovation Conference, Santa Clara, California
26 juil. 2018 08h00 HE
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eSilicon
SAN JOSE, Calif., July 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASIC design, market-specific IP platforms and advanced 2.5D packaging solutions, will present...
22 Students graduate eSilicon’s FAST Academy work-study program
24 juil. 2018 01h00 HE
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eSilicon
BUCHAREST, Romania, July 24, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today at...
7nm networking platform delivers unprecedented performance and configurability for data center ASICs
26 juin 2018 08h00 HE
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eSilicon
SAN JOSE, Calif., June 26, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the...
eSilicon at DAC: eSilicon announces new networking platform
19 juin 2018 08h00 HE
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eSilicon
Presentations Tuesday, June 26 at Chip Estimate Booth 2:00-2:15 PM; Samsung Theatre 3:00-3:15 PM; Mentor Booth 4:00 – 5:00 PM Join us at Stars of IP Party for appetizers, hosted bar, prizes and fun ...
eSilicon revolutionizes machine learning ASIC platform (MLAP) market
05 juin 2018 08h30 HE
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eSilicon
SANTA CLARA, Calif., June 05, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced 2.5D packaging solutions, announced today at the Machine...
eSilicon deep learning ASIC in production qualification
01 mai 2018 08h00 HE
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eSilicon
Chip employs TSMC CoWoS® technology to integrate SoC and HBM2 SAN JOSE, Calif., May 01, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP, and advanced...
eSilicon trao tặng 07 học bổng cho Nữ sinh hàng đầu khối ngành STEM tại Việt Nam
04 avr. 2018 18h00 HE
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eSilicon
SAN JOSE, California, Hoa Kỳ và thành phố Hồ Chí Minh, Việt Nam, April 05, 2018 (GLOBE NEWSWIRE) -- eSilicon, nhà cung cấp thiết kế chip ASICs, lõi IP và các giải pháp đóng gói 2.5D...
eSilicon awards seven scholarships to top female STEM students in Vietnam
04 avr. 2018 18h00 HE
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eSilicon
SAN JOSE, Calif. and HO CHI MINH CITY, Vietnam, April 04, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, has...
ASICs Unlock Deep Learning Innovation: Webinar May 2, 2018
03 avr. 2018 08h30 HE
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eSilicon; Samsung Electronics Co., Ltd.; Amkor Technology, Inc.; Northwest Logic
SAN JOSE, Calif., April 03, 2018 (GLOBE NEWSWIRE) -- Deep learning applications require extreme performance, low power and high efficiency to effectively process the massive amounts of data used in...
eSilicon to present: Enabling Technology for the Cloud and AI – One Size Fits All?
27 mars 2018 05h30 HE
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eSilicon
SAN JOSE, Calif., March 27, 2018 (GLOBE NEWSWIRE) -- eSilicon, an independent provider of FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, will present Enabling Technology for...