Promex Industries and QP Technologies Appoint Jeannine Serbanich as Vice President of Finance
04 déc. 2024 09h00 HE
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Promex Industries
Promex Industries and its QP Technologies division have named Jeannine Serbanich VP of Finance for the two companies.
ZFlo Technologies and LOOT8, Inc. Announce Joint Venture to Revolutionize Package Security, Addressing a $30 Billion Annual Problem
25 sept. 2024 09h15 HE
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Gold Rock Holdings, Inc.
ZFlo Technologies and LOOT8, Inc. Announce Joint Venture to Revolutionize Package Security, Addressing a $30 Billion Annual Problem
Promex Industries and QP Technologies Implement Sales/Marketing Reorganization, Promoting Rosie Medina to Promex Senior Vice President and Matt Hansen to QP Technologies Vice President
29 juil. 2024 09h00 HE
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Promex Industries
Promex Industries and QP Technologies have announced a sales/marketing reorganization aimed at growing both companies’ core businesses.
QP Technologies™ Boosts Process Capabilities, Expands Team to Target New and Growing Markets
03 oct. 2022 08h00 HE
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QP Technologies
BOSTON, Oct. 03, 2022 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it is expanding its...
QP Technologies™ Sees Double-Digit Growth, Expands Team and Offerings to Meet Customer Needs
29 sept. 2021 09h00 HE
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QP Technologies
ESCONDIDO, Calif., Sept. 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, has added multiple new...
Trurenu Poly Packaging by Glenroy® Approved for Nextrex® Recycling Program
28 sept. 2021 09h05 HE
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Trex Company, Inc.
MILWAUKEE, Sept. 28, 2021 (GLOBE NEWSWIRE) -- Glenroy, Inc., a leading producer of sustainable flexible packaging, has teamed with Trex Company, the world’s largest manufacturer of wood-alternative...
QP Technologies™ Installs New Wire Bonders, Broadening Reach in Mil-Aero, RF, Power Markets
16 août 2021 09h00 HE
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QP Technologies
ESCONDIDO, Calif., Aug. 16, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced it has...
QP Technologies™ Expands Interposer Design Capabilities
29 mars 2021 09h00 HE
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QP Technologies
ESCONDIDO, Calif., March 29, 2021 (GLOBE NEWSWIRE) -- QP Technologies™ (formerly Quik-Pak), a leading provider of innovative microelectronic packaging and assembly solutions, today announced...
Quik-Pak Becomes QP Technologies™
11 mars 2021 09h00 HE
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QP Technologies
New brand reflects growing breadth of company’s technology and engineering capabilities ESCONDIDO, Calif., March 11, 2021 (GLOBE NEWSWIRE) -- Leading provider of microelectronic packaging and...
Quik-Pak, Agile Microwave Technology and OMMIC Verify RF-Capable Packaging Solutions for 5G and IoT Semiconductor Devices
06 oct. 2020 09h00 HE
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Quik-Pak
ESCONDIDO, Calif., Oct. 06, 2020 (GLOBE NEWSWIRE) -- Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages....