eSilicon's Javier DeLaCruz to Moderate the 2.5D/3D Packaging Panel at the GSA Silicon Summit
01 avr. 2014 08h30 HE
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eSilicon
SAN JOSE, CA--(Marketwired - Apr 1, 2014) -
What: Enabling a 2.5D/3D Ecosystem
Where:
GSA Silicon Summit
Computer History Museum, Mountain View, California
...
Ziptronix Teams With Tezzaron and Novati Technologies to Accelerate Development of 3D ICs
09 déc. 2013 08h00 HE
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Ziptronix
RESEARCH TRIANGLE PARK, NC--(Marketwired - Dec 9, 2013) - Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, today announced an agreement with...
SSEC Introduces WaferEtch and WaferStorm Platforms to Its Portfolio of Single Wafer Wet Processing Solutions at SEMICON West 2013
08 juil. 2013 08h00 HE
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Solid State Equipment LLC
HORSHAM, PA--(Marketwired - Jul 8, 2013) - Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of...
STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution
05 nov. 2012 16h00 HE
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STATS ChipPAC
SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES--(Marketwire - Nov 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...
STATS ChipPAC Advances Through Silicon Via Capabilities With the Qualification of 300mm Mid-End Processing and Low Volume Manufacturing
27 août 2012 16h00 HE
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STATS ChipPAC
SINGAPORE--28/08/2012, UNITED STATES--(Marketwire - Aug 27, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Expands Through Silicon Via Capabilities With Mid-End Processing
18 avr. 2011 16h00 HE
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STATS ChipPAC
SINGAPORE - 4/19/2011, UNITED STATES--(Marketwire - Apr 18, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...