Deca collaborates with ASE and Siemens to launch APDK™ design methodology TEMPE, Ariz., March 18, 2021 (GLOBE NEWSWIRE) -- Deca, an industry-leading pure-play technology provider for advanced semiconductor packaging, announced the introduction of its new APDK™ (Adaptive...

Deca Partners with ADTEC Engineering to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling TEMPE, Ariz., Oct. 20, 2020 (GLOBE NEWSWIRE) -- Deca, an industry-leading provider of advanced electronic interconnect technologies, announced today the signing of an agreement with ADTEC...

Deca Technologies Unveils M-Series(TM) CSP With Adaptive Patterning(TM) TEMPE, AZ--(Marketwire - Nov 7, 2012) -  Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced the introduction of the new...