Diamond Slurry SiC Wafer Polishing Centrifuges Lead Growth in Global SiC Wafer Polishing Market with 37.5% CAGR to 2028 Dublin, Sept. 14, 2023 (GLOBE NEWSWIRE) -- The "Global SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), Application,...

NexPlanar Secures $10 Million for Capacity Expansion of Semiconductor CMP Pad Technology HILLSBORO, OR--(Marketwire - March 31, 2011) -  NexPlanar Corporation recently completed a $10.0 million round of Series D funding to expand production capacity both in the U.S. and to strategic...

New NexPlanar CTO to Lead Advanced CMP Pad Product Development HILLSBORO, OR--(Marketwire - March 8, 2011) - NexPlanar, the semiconductor CMP pad technology company, has tasked its recently hired CTO, Rajeev Bajaj, with expanding on the core capabilities of...