Transformative Growth: Global Flip Chip Bonder Market Size to Exceed USD 356.91 Million by 2030 with 3.28% CAGR New York, NY, Aug. 08, 2023 (GLOBE NEWSWIRE) -- Zion Market Research has published a new research report titled “Flip Chip Bonder Market By Type (Fully Automatic And Semi-Automatic), By Application...

Sequans Integrates MicroEJ Edge Container on its Monarch 2 LTE-M/NB-IoT Platform Standard software container provides Sequans customers with the fastest go-to-production track, with budget and design time cut by up to halfDemo of MICROEJ VEE (the Edge container) for Monarch 2 at...