A larger Hispack seeks to accelerate responsible packaging solutions
25 avr. 2024 09h19 HE
|
Fira De Barcelona
Hispack 2024 will gather 780 exhibitors and 1,250 brands at Fira de Barcelona's Gran Via venue from May 7 to 10 with a focus on sustainable packaging.
NXP Introduces Secure UWB Fine Ranging Chipset to Allow Broad Deployment in Mobile Devices
17 sept. 2019 09h00 HE
|
NXP USA, Inc.
News Highlights: World’s first all-in-one solution to combine Secure Element (SE), Near Field Communications (NFC) and Ultra-Wide Band (UWB) fine-ranging technologyDelivers unparalleled precision...