Underfill Market Is Expected to Reach USD 846.9 million by 2030, Grow at a CAGR Of 8.99% during Forecast Period 2023 To 2030 | Data By Contrive Datum Insights Pvt Ltd.
28 avr. 2023 06h02 HE
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Contrive Datum Insights Pvt Ltd
Farmington, April 28, 2023 (GLOBE NEWSWIRE) -- The Global Underfill Market Was Valued At USD 357.8 Million In 2022 And Is Expected To Expand USD 846.9 Million By 2030 at a CAGR Of 8.99% From 2022...
Industrial Electronics Packaging Market to attain a net worth of US$ 2.5 Bn by the end of 2029 - Comprehensive Research Report by FMI
18 janv. 2022 11h30 HE
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Future Market Insights Global and Consulting Pvt. Ltd.
DUBAI, United Arab Emirates, Jan. 18, 2022 (GLOBE NEWSWIRE) -- The global industrial electronics packaging market currently enjoys a valuation of US$ 1.9 Bn, and is predicted to expand at a CAGR...
AVX's New Wire-to-Board Connectors Deliver Considerable Cost & Space Savings in Industrial Electronics Designs
05 mai 2016 09h58 HE
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AVX Corporation
FOUNTAIN INN, S.C., May 5, 2016 (GLOBE NEWSWIRE) -- AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released two new series of wire-to-wire (WTW)...
AVX Releases New 2mm Vertical Poke-Home WTB Contact for Light Industrial Applications
12 mai 2015 14h15 HE
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AVX Corporation
GREENVILLE, S.C., May 12, 2015 (GLOBE NEWSWIRE) -- AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released a new 2mm vertical poke-home wire-to-board...