ROHM Semiconductor and Valeo Co-Develop the Next Generation of Power Electronics
26 nov. 2024 17h00 HE
|
ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Nov. 26, 2024 (GLOBE NEWSWIRE) -- ROHM Semiconductor and Valeo, a leading automotive technology company, today announced they are collaborating to propose and...
Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
06 déc. 2023 08h00 HE
|
Microchip Technology Inc.
CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume manufacturing. To better automate the...
ROHM Introduces Ultra-Low-Profile, 12W Rated Metal Plate Shunt Resistor, Ideal for Double-Sided Cooled Power Modules in Automotive and Industrial Equipment
27 avr. 2023 17h00 HE
|
ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, April 27, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the industry’s thinnest[1] (H: 0.03-inch) 12W rated metal plate shunt resistor (PSR350),...
Partnership for True Multiple Sourcing: ROHM IGBTs with Semikron Danfoss Power Modules
25 avr. 2023 17h00 HE
|
ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, April 25, 2023 (GLOBE NEWSWIRE) -- Kyoto-based ROHM Semiconductor and Semikron Danfoss have been collaborating for more than ten years with regards to the...
Bare Die SiC from ROHM Chosen by Apex Microtechnology for Newest Line of Power Modules
20 mars 2023 17h00 HE
|
ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, March 20, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced that precision power analog company Apex Microtechnology is adopting ROHM’s silicon carbide...
ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters for e-Axle Using ROHM SiC Power Modules
22 nov. 2022 17h00 HE
|
ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Nov. 22, 2022 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced they have signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen...
Zhenghai Group and ROHM Agree to Establish a Joint Venture in the SiC Power Module Business
27 oct. 2021 17h00 HE
|
ROHM Semiconductor
Santa Clara, CA and Kyoto, Japan, Oct. 27, 2021 (GLOBE NEWSWIRE) -- Zhenghai Group Co., Ltd. (Zhenghai Group) and ROHM Co., Ltd. (ROHM) have signed a joint venture agreement to establish a new...
Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
20 sept. 2021 08h05 HE
|
Microchip Technology Inc.
CHANDLER, Ariz., Sept. 20, 2021 (GLOBE NEWSWIRE) -- As demand for electric buses and other electrified heavy transport vehicles increases to meet lower emission targets, silicon carbide-based power...
First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
03 août 2021 08h05 HE
|
Microchip Technology Inc.
CHANDLER, Ariz., Aug. 03, 2021 (GLOBE NEWSWIRE) -- In the race to reduce aircraft emissions, developers increasingly are moving toward more efficient designs including electrical systems that...
Microchip Boosts Gallium Nitride (GaN) Radio Frequency (RF) Portfolio with Ka-band Monolithic Microwave Integrated Circuit (MMIC) with High Linearity for SatCom Terminals
21 juin 2021 08h01 HE
|
Microchip Technology Inc.
CHANDLER, Ariz., June 21, 2021 (GLOBE NEWSWIRE) -- Satellite communication systems use complex modulation schemes to achieve the blazingly fast data rates required to deliver video and broadband...