Arizona State University and Deca Technologies to Pioneer North America’s First R&D Center for Advanced Fan-Out Wafer-Level Packaging Deca Technologies and ASU today announced a collaboration to create North America’s first fan-out wafer-level packaging research and development center.

Beroni Group Sets Up a New R&D Centre in High-Tech Hub in Zhuhai, China NEW YORK and SYDNEY, Australia, Jan. 31, 2022 (GLOBE NEWSWIRE) -- Beroni Group (OTCQX: BNIGF; NSX: BTG) (“Beroni” or the “Company”), an Australia-based diversified biopharmaceutical enterprise...

Integer to Construct New Innovation and Manufacturing Facility in Galway, Ireland PLANO, Texas, Sept. 22, 2021 (GLOBE NEWSWIRE) -- Integer Holdings Corporation (NYSE: ITGR), a leading medical device outsource (MDO) manufacturer, today announced it will further expand its presence...