Global Semiconductor Packaging Market to Reach $60.44 Billion by 2030: Allied Market Research Portland,OR, July 22, 2021 (GLOBE NEWSWIRE) -- As per the report published by Allied Market Research, the global semiconductor packaging market generated $27.10 billion in 2020, and is expected to...

Senseg Introduces World’s First Flexible Actuators Manufactured With Roll-To-Roll Technology ESPOO, Finland, Aug. 27, 2019 (GLOBE NEWSWIRE) -- Senseg, a leader in electrostatic haptics, today announced that it has created a new category of flexible electronics by launching a family of...

Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution MILPITAS, CA--(Marketwired - September 12, 2017) - Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully completed silicon validation of its High Bandwidth...

Media Advisory: Open-Silicon Shows Breadth of ASIC Solutions at ARM TechCon 2014 MILPITAS, CA--(Marketwired - September 24, 2014) - Open-Silicon, an ASIC solutions provider, today announced it will participate in ARM® TechCon 2014 with booth demonstrations showcasing the company's...