SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
30 oct. 2019 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) -- Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by SEAKR® Engineering...
Kandou Announces 100th Patent Grant by U.S. Patent Office
11 déc. 2018 07h00 HE
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Kandou Bus
LAUSANNE, Switzerland, Dec. 11, 2018 (GLOBE NEWSWIRE) -- Kandou Bus S.A., the global pioneer in multi-wire SerDes technology, today announced that the United States Patent and Trademark Office has...