STATS ChipPAC's Copper Wirebond Shipments Exceed One Billion Units SINGAPORE -- 19/06/2012, UNITED STATES--(Marketwire - Jun 18, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...

STATS ChipPAC Ships Over 300 Million Copper Wirebond Units and Expands Fine Pitch Solutions SINGAPORE--5/4/2011, UNITED STATES--(Marketwire - May 3, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service...