Kitron's new cu-technology allows effective thermal management and better RF performance as compared to standard printed thick film solutions.
50 GHz
RF loss testing indicates copper plated ceramics is among the best of all ceramic interconnection technologies, at frequencies from DC to 50 GHz.
In addition to the excellent high-frequency RF performance, the copper metallization offers exceptional thermal performance as well. This is due to the superior heat-spreading characteristics of pure copper metallization.
Superior Thermal Conductivity
The copper plated thick film process is specifically designed for high power applications requiring air-fired, thick film resistors. It offers advantages over conventional thick film technology, particularly in the areas of thermal management, DC and RF conductor loss, and solderability.
10x Better than Laminates
The thick, plated copper spreads heat away from the die much more effectively than conventional thick film, resulting in lower die temperatures and longer life.The technology offers a thermal advantage of 8x-10x over laminates, and a more than 5x electrical conductivity advantage over conventional thick film. In addition, this technology offers precise line geometry. Copper on alumina ceramic gives a carrier with superior electrical and thermal conductivity.
A short form brochure can be downloaded here:
50 GHz
RF loss testing indicates copper plated ceramics is among the best of all ceramic interconnection technologies, at frequencies from DC to 50 GHz.
In addition to the excellent high-frequency RF performance, the copper metallization offers exceptional thermal performance as well. This is due to the superior heat-spreading characteristics of pure copper metallization.
Superior Thermal Conductivity
The copper plated thick film process is specifically designed for high power applications requiring air-fired, thick film resistors. It offers advantages over conventional thick film technology, particularly in the areas of thermal management, DC and RF conductor loss, and solderability.
10x Better than Laminates
The thick, plated copper spreads heat away from the die much more effectively than conventional thick film, resulting in lower die temperatures and longer life.The technology offers a thermal advantage of 8x-10x over laminates, and a more than 5x electrical conductivity advantage over conventional thick film. In addition, this technology offers precise line geometry. Copper on alumina ceramic gives a carrier with superior electrical and thermal conductivity.
A short form brochure can be downloaded here: