SCOTTS VALLEY, Calif., March 7, 2006 (PRIMEZONE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry announced today that Mr. Rick Flowers has been promoted to VP of Worldwide Sales and Marketing. Mr. Flowers will be based in Malaysia and will be assuming the responsibilities previously held by Mr. N.F. Lee, who has announced his retirement, effective the end of June, having been with Carsem for 28 years.
Rick Flowers has been with the company for twelve years. Initially as Director of Sales for North America, Western Region and for the past four years as Vice President of North American Sales.
Greg Johnson has joined the company as Vice President on North American Sales reporting to Rick Flowers and is based in Carsem's Scotts Valley office.
Greg has over eighteen years of experience in the semiconductor industry. Prior to joining Carsem, he was President of Sales at Signetics High Technology and prior to that, he was Vice President of Worldwide Customer Service at ASAT, Inc. He has also held various positions in the industry including Sales and Marketing Manager for Rohm Corporation and Director of Sales and Customer Service at Amkor Technologies.
Mr. Johnson stated, "I am impressed with the Carsem organization and the company's commitment to providing high quality products and services to our customers. I look forward to helping us strengthen our market position."
Dave Comley, Carsem Group Managing Director stated, "On Behalf of the shareholders and employees of Carsem, I would like to thank N.F. Lee for his outstanding contribution to the performance of Carsem, and on a personal note, for his support and friendship over the years. He will truly be missed and we wish him well." Comley further stated, "I am confident that both Rick and Greg will continue to expand our current relationships with our customers as well as find new ways to grow our business."
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package and test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the U.K. and Taiwan. Carsem, Inc.'s sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.