SCOTTS VALLEY, Calif., March 20, 2006 (PRIMEZONE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they received Microsemi Corporation's (Integrated Products Group) Supplier of the Year Award for 2005 in the category of Assembly and Test. The award is based on an exacting supplier rating program that includes key metrics, such as on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology.
During a recent Quarterly Business Review, Kevin Boyle, Microsemi's Director of Manufacturing, presented the award to T.L. Soo, General Manager of Carsem's M-site.
"Microsemi chose to recognize Carsem because they were rated the number one supplier in each of the four quarters of 2005 based on Microsemi's supplier rating system. Carsem has made significant strides in improving quality and customer service. Also, their facility in Suzhou, China was able to ramp quickly to meet our increased demand on the MLP package during the last quarter of 2005," stated Mr. Boyle.
"Carsem is truly honored to receive this award. This achievement is the result of a true team effort involving both Carsem and Microsemi staff. We look forward to strengthening our relationship and will continue to support Microsemi as their business continues to grow," stated Mr. Soo.
Mr. David Comley, Carsem Group Managing Director, added "I am proud that our team received Microsemi's Supplier of the Year Award for 2005. It clearly demonstrates our commitment of providing quality services and building strong relationships with our customers. We are truly honored."
About Microsemi Corporation
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implantable medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the U.S.A., plus the U.K. and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.