SCOTTS VALLEY, Calif., Feb. 23, 2007 (PRIME NEWSWIRE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they have received Microsemi Corporation's Analog Mixed Signal Group Supplier of The Year Award for 2006 in the category of Assembly and Test for Carsem Suzhou. The award is based on a supplier program that measures key metrics such as on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology.
During a recent ceremony in Suzhou China, Ric Santos, Manager, Microsemi Subcon Management Group-Asia, presented the award to T.W.Hee, General Manager of Carsem Suzhou. MIP Operations Director, Kevin Boyle and Production Control / Planning Manager, Tiffany Vendange also attended the ceremony via teleconference.
"Microsemi is pleased to give our annual award to Carsem Suzhou as they have shown improvements in all areas especially customer service for four (4) consecutive quarters and have been able to support significant upsides in volume," stated Kevin Boyle.
"Receiving this award for the second consecutive year is an honor, first by Carsem Malaysia last year and Carsem Suzhou this year. I would like to congratulate our team for an excellent job supporting one of our key customers. A true team effort involving Microsemi and Carsem staff has been a key to our success. We look forward to strengthening our relationship with Microsemi in the future," stated T.W. Hee.
About Microsemi Corporation
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implantable medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest ranges of package and test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL), and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the U.S.A., plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.