Inapac Technology Products Selected by Vimicro for Mobile Multimedia Processors

SAN JOSE, CA -- (MARKET WIRE) -- March 5, 2007 -- Inapac Technology, Inc. today announced that Vimicro Corporation (NASDAQ: VIMC), a leading fabless semiconductor company in China, will begin using memory die based on Inapac's SiPFLOW™ DFT (design-for-test) methodology to deliver low-cost, reliable SiP (system-in-package) solutions. The low-power DRAM devices, which are optimized for SiP and MCP (multi-chip-package) applications, will be incorporated into Vimicro's recently announced Vinno family of multimedia processors, which target the mobile phone handset market and offer one of the industry's highest levels of multimedia-function integration.

Inapac's 16Mb (megabit) and 32Mb SiPFLOW DRAM products have already achieved high-volume production status, and are addressing memory needs in mobile phones and a variety of other consumer applications. Inapac's unique SiPFLOW platform methodology has demonstrated reduced overall cost of ownership, while ensuring high yield and reliability of SiPs.

"The demand for multimedia capabilities is exploding in mobile communications, and Vimicro seeks to maintain a product portfolio that provides the necessary range of multimedia processors, based on our expertise in system, firmware, embedded software and multimedia SoC design," said Kevin Jin, president and COO at Vimicro. "The addition of DRAM based on Inapac's DFT platform and methodology will give us the opportunity to continue expanding the capabilities of our processors, while also controlling cost and achieving the reliability that our customers require."

"We're very excited to have the leading Chinese multimedia processor company select SiPFLOW-enabled DRAM for its Vinno product line," said Naresh Baliga, vice president of marketing at Inapac. "This represents a significant step for Inapac, allowing us to help meet the needs of one of the world's fastest growing mobile phone markets."

The SiPFLOW Platform

The Inapac SiPFLOW platform addresses the challenges of ensuring the quality of KGD (known-good die) memory components and achieving consistent, reliable system assembly. To support these goals, it integrates a unique and proprietary test bus that allows both full wafer test without burn-in and testing of the finished SiP/MCP.

Wafer-level test uses Inapac's VIBE™ (Voltage-Induced Burn-in Emulation) voltage-based methodology, which is equivalent to traditional oven-based burn-in testing but eliminates the specialized capital and test cost burden of using elevated temperatures.

After assembly, the memory portion of the SiP/MCP can be fully exercised and tested using the Inapac SiPLINK™ test technology. This, for the first time in the industry, enables the SiP/MCP integrator to screen out quality-related issues that may have been introduced as a result of the assembly process. All testing is done with industry-standard test equipment. In addition, test results can be accumulated by Inapac and used to fine-tune the manufacturing process to further increase yields and reliability.

About Vimicro

Vimicro International Corporation (Vimicro) is a fabless semiconductor company that designs, develops and markets semiconductor products and solutions that enable multimedia capabilities in a variety of products for the consumer electronics and communications markets. The Company primarily designs, develops and markets multimedia processors for personal computers (PCs) and mobile phones. The Vinno processors are a family of high-performance mobile multimedia application processors with the highest level of integration of the new multimedia functions, such as MPEG4 and H.264 video, MP3, AAC/aacPlus and WMA audio, video conferencing and graphics for gaming, as well as other popular features, such as multi-mega-pixel cameras, polyphonic ringtone, 3D stereo sound, and many analog and mixed-signal circuits. For more information, visit the company's Web site at http://www.vimicro.com.

About Inapac

Inapac Technology, Inc. is a leading provider of memory technology and services for SiP (system-in-package) and MCP (multi-chip-package) solutions. Inapac provides IP and services based on a DFT (design-for-test) production methodology to deliver reliable, cost-effective memories. Products based on the company's proven SiPFLOW™ platform are licensed to semiconductor companies to enhance the performance, quality and reliability of products in the cell phone, consumer audio/video, digital imaging, and storage markets.

Inapac is headquartered in San Jose, California, with additional offices in Boise, Idaho, and Hsin-chu, Taiwan. For more information, visit the company's website at www.inapac.com.

Contact Information: Contacts: Inapac Technology, Inc. Naresh Baliga 408-434-6530 x242 Email Contact FS Communications Joe Fowler 650-691-1488 Email Contact Vimicro International Corp. Edward Yang 86-10-6894-8888 e-mail: Email Contact