Inapac Teams With e-MDT for Sales and Application Support in Korea

SAN JOSE, CA--(Marketwire - November 5, 2007) - Inapac Technology, Inc., a leading provider of DRAM solutions optimized for system-in-package (SiP) and multi-chip-package (MCP) devices, today announced an agreement with e-MDT, Inc., a Seoul-based ASIC design and development company, to serve as Inapac's representative for the Korean market. Under the agreement, e-MDT adds DRAM based on Inapac's proven SiPFLOW™ design-for-test (DFT) intellectual property (IP) to its product portfolio, and will serve as a design center partner for Inapac customers in the Korean market.

With SiPFLOW platform-based memory, e-MDT now offers a proven production and test methodology for integrating cost-effective, known-good-die (KGD) DRAM with logic die to produce reliable SiP/MCP devices for high-volume applications. Inapac's approach enables the lowest cost of ownership for stacked DRAM in high-volume SiP/MCP implementations, while achieving industry-leading reliability rates of less than 100 dppm (defective parts per million).

eMDT, which has achieved notable success with the leading Korean cell phone companies, will combine its extensive ASIC and SoC design services and its back-end testing and verification expertise with SiPFLOW-based KGD to deliver SiP/MCP solutions optimized for cellular handset and digital display applications.

"We are extremely pleased to add Inapac's products to our portfoliio," said Jay Jeong, president and CEO of e-MDT. "This agreement enables us to deliver cost and reliability advantages over traditional KGD approaches, allowing the industry's leading electronics companies to quickly and cost-effectively implement SiPs/MCPs for their high-volume applications."

"We're very excited about establishing a relationship with e-MDT," said Naresh Baliga, vice-president of marketing at Inapac. "This represents a major expansion of our ability to serve the Korean market, which is a strong and growing consumer of SiPs and MCPs for cell phones and other portable devices. With its established history and reputation in providing ASIC, SoC and SiP/MCP solutions, e-MDT is an ideal partner to help expand use of Inapac DRAM designs and the SiPFLOW methodology."

The SiPFLOW Platform

The Inapac SiPFLOW platform balances low-cost production and high reliability for DRAM die, making it easier and less expensive to integrate memory into single-package devices. It combines SiP/MCP-optimized memory IP with a complete, integrated test infrastructure that provides significant cost efficiencies at both the wafer sort and final test steps.

After assembly, the memory portion of the SiP/MCP can be fully exercised and tested using the Inapac SiPLINK™ test connections and conventional high-volume memory test equipment. In addition, the SiPFLOW methodology allows for continuous improvement over the SiP/MCP product lifecycle. With it, test results can be accumulated and analyzed to fine-tune the manufacturing process and to further correlate wafer sort and final test results to achieve increased yield and reliability.

About e-MDT

e-MDT is a specialized fabless and chipless ASIC company that provides full turn-key, extended SoC design services, including integrated circuit design, intellectual property design, fabrication, and supply chain management. It has fully staffed ASIC design centers in both the United States and Korea, specializing in the design of sub-micron ASIC and ASSP integrated circuits, along with intellectual property necessary to design new innovative products for emerging markets. e-MDT provides the traditional back-end design services, and also provides full turn-key, front-end design services. The company couples innovative ASIC designs with manufacturing services provided by its foundry partners to deliver the most cost-effective ASIC design solutions in the shortest period of time. For more information, visit the company's Web site at www.e-mdt.com.

About Inapac

Inapac Technology, Inc. is a leading provider of memory technology and services for system-in-package (SiP) and multi-chip-package (MCP) solutions. Inapac provides IP and services based on a design-for-test (DFT) production methodology to deliver reliable, cost-effective memories. Products based on the company's proven SiPFLOW™ platform are licensed to semiconductor companies to enhance the performance, quality and reliability of products in the cell phone, consumer audio/video, digital imaging, and storage markets. Inapac is headquartered in San Jose, California, with additional offices in Boise, Idaho, and Hsin-chu, Taiwan. For more information, visit the company's website at www.inapac.com.

Contact Information: Contacts: Inapac Technology, Inc. Naresh Baliga Tel: 408-434-6530 x242 FS Communications for Inapac Joe Fowler Tel: 650-691-1488 Brian Kang e-MDT, Inc. Tel: 408-986-0800 TK Kim e-MDT, Inc. Tel : 82-2-3012-1300