Infinera Demonstrates 40G Advanced Modulation On a PIC

Second Demo Shows PIC With On-Chip Amplification for S-Band Transmission


SUNNYVALE, Calif., Feb. 22, 2008 (PRIME NEWSWIRE) -- Infinera (Nasdaq:INFN) is today announcing the results of two lab demonstrations with significant implications for the future development path of photonic integration and high-capacity optical networks.

In the first demonstration, Infinera successfully developed and tested a photonic integrated circuit (PIC) that integrates ten wavelengths of data at 40 Gigabits/second (Gb/s) per wavelength, using Differential Quadrature Phase-Shift Keying (DQPSK) modulation, for an aggregate data rate of 400 Gb/s. The implementation of DQPSK modulators on an Infinera PIC will enable the commercial production of the next generation of PICs, with a capacity per chip of 400 Gb/s. This PIC integrates more than 100 optical devices on a single chip, more than double that of today's 100 Gb/s PIC.

DQPSK modulation is an advantageous scheme for increasing the data rate on each DWDM channel as it offers high spectral efficiency, high tolerance to impairments including dispersion, and superior optical signal-to-noise tolerance, thereby maximizing optical reach.

"This implementation of a 400 Gb/s PIC using 10 sets of Mach-Zehnder modulators at 40 Gb/s achieves performance similar to discrete implementations of 40G DQPSK," said Fred Kish, Infinera Vice President, Development and Manufacturing." But the use of photonic integration to integrate dozens of optical devices into a single package dramatically scales the capacity per chip while simplifying the design and manufacture of the part, and has the potential to deliver significant improvements in the areas of cost, power consumption, and reliability," Dr. Kish added.

SOAs to Address Full Fiber Spectrum

In the second lab demonstration, Infinera demonstrated successful transmission of data with a 100 Gb/s PIC using on-chip semiconductor amplifiers (SOAs) in the S-band over a distance of 320 kilometers. Today's DWDM networks are limited by EDFA (erbium-doped fiber amplifier) technology, which can only amplify effectively over a very limited range of the optical spectrum. Known as the C-band, this range accounts for just 4.4 TeraHertz (THz), out of a full fiber spectrum of 55 THz. Amplification by SOAs can allow transmission in spectral regions inaccessible in systems reliant upon EDFA amplification, opening up the full fiber spectrum for data transmission. In this demonstration, a ten-channel PIC with integrated SOAs successfully transmitted error-free data in the 1490 nanometer range of the S-band without external dispersion compensation.

"Opening up the full potential fiber bandwidth into spectral regions inaccessible with EDFAs is a significant innovation for optical networks," commented Infinera director of optical systems Steve Grubb. "Photonic integrated circuits enable cost-effective use of SOAs and thus offer the possibility of scaling optical networks across the full fiber spectrum. As we look for ways to economically scale network capacity to respond to increased demand from IP traffic, this significantly expands the current WDM tool kit."

Infinera representatives will be available to discuss these and other results at next week's OFC/NFOEC 2008, the annual trade show and conference for the optical networking industry, which runs from Sunday Feb. 24th through Thursday Feb. 28th at the San Diego Convention Center. From Tuesday through Thursday, Infinera will maintain a suite of meeting rooms one level above the trade show floor for meetings with customers and other partners. In addition, Infinera CEO, Jagdeep Singh and Chief Marketing and Strategy Officer, Dave Welch will hold a briefing for investors, analysts and media on Wednesday at 11:30 a.m. at which they will discuss these results. Those interested in attending should contact the Infinera representatives below.

About Infinera

Infinera provides Digital Optical Networking systems to telecommunications carriers worldwide. Infinera's systems are unique in their use of a breakthrough semiconductor technology: the Photonic Integrated Circuit (PIC). Infinera's systems and PIC technology are designed to provide optical networks with simpler and more flexible engineering and operations, faster time-to-service, and the ability to rapidly deliver differentiated services without reengineering their optical infrastructure. For more information, please visit www.infinera.com.

The Infinera logo is available at http://www.primenewswire.com/newsroom/prs/?pkgid=3830

This press release contains certain forward-looking statements based on current expectations, forecasts and assumptions that involve risks and uncertainties. These statements are based on information available to Infinera as of the date hereof; and actual results could differ materially from those stated or implied, due to risks and uncertainties. Forward-looking statements include statements regarding Infinera's expectations, beliefs, intentions or strategies regarding the future, such as the benefits and capabilities of our products and the Digital Optical Network's architecture, that DQPSK modulation is an advantageous scheme, that use of photonic integration would dramatically simplify the design and manufacture of the part, and that amplification by SOAs allows transmission in spectral regions inaccessible with EDFA amplification opening up the full potential fiber bandwidth. Such forward-looking statements can be identified by forward-looking words such as "anticipated," "believed," "could," "estimate," "expect," "intend," "may," "should," "will," and "would" or similar words. The risks and uncertainties that could cause our results to differ materially from those expressed or implied by such forward-looking statements include aggressive business tactics by our competitors, our dependence on a single product, our ability to protect our intellectual property, claims by others that we infringe their intellectual property, our manufacturing process is very complex, product performance problems we may encounter, our dependence on sole or limited source suppliers, our ability to respond to rapid technological changes, our ability to maintain effective internal controls, the ability of our contract manufacturers to perform as we expect, a new technology being developed that replaces the PIC as the dominant technology in optical networks, general political, economic and market conditions and events, including war, conflict or acts of terrorism; and other risks and uncertainties described more fully in our annual report on Form 10-K filed with the Securities and Exchange Commission on February 19, 2008, our public announcements and other documents filed with or furnished to the Securities and Exchange Commission. These statements are based on information available to us as of the date hereof and we disclaim any obligation to update the forward-looking statements included in this press release, whether as a result of new information, future events or otherwise.



            

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