SCOTTS VALLEY, Calif., Feb. 28, 2008 (PRIME NEWSWIRE) -- Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they have received RDA Microelectronics Supplier Appreciation Award for 2007. The award is based on an exacting supplier program that includes key metrics such as on-time delivery, yield, customer service, quality, competitiveness, responsiveness and technology.
During a recent ceremony held on January 4, 2008 at the RDA Microelectronics facility, Vincent Tai, RDA Microelectronics CEO, presented the Award to T.W. Hee, Carsem Suzhou General Manager. Also on hand for the presentation were Aisong Liang, RDA Finance Manager, Zhi Zhou, RDA Operations Manager, Wang Ning, RDA QA Manager, and members of the Carsem Suzhou Sales and Support team.
"Carsem has been a great supplier to RDA. Without the close partnership and support from Carsem, RDA would have had difficulty sustaining our rapid growth in 2007. Carsem's understanding of the local market and dedication to its customers makes this award well deserved," stated Vincent Tai.
"Carsem is honored to be recognized as a key supplier by RDA Microelectronics. We are committed to strengthening our partnership with RDA as their business continues to grow in the future," stated T.W. Hee.
About RDA Microelectronics
RDA is the leading RF IC company in China. It provides advanced CMOS based complex and highly integrated RF IC and GaAs based RF Front-end Modules for wireless, broadcast and consumer products. RDA's customers include the leading tier-one China manufacturers.
About Carsem
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL) and a SiP (System-in-Package) capability. Carsem also offers a full range of turnkey test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards, having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia, Suzhou, China and sales offices across the USA, plus the UK and Taiwan. Carsem, Inc. sales headquarters is located at 269 Mt. Hermon Road, Suite 104, Scotts Valley, CA 95066, phone (831) 438-6861, fax (831) 438-6863, web site: www.carsem.com.