STATS ChipPAC Receives Supplier Excellence Award From Analog Devices

SINGAPORE -- 05/15/2009, UNITED STATES--(Marketwire - May 14, 2009) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced that it has received Analog Devices, Inc.'s 2008 Supplier Excellence Award for contracted production and its outstanding performance in full turnkey packaging and test services.

"STATS ChipPAC has distinguished itself by delivering a superior service level and demonstrating a commitment to customer satisfaction. We are elated to be recognized for our operational excellence in cost reduction, technology, innovation, quality and customer service," said Tan Lay Koon, President and Chief Executive Officer, STATS ChipPAC. "We are truly honored to be recognized by Analog Devices with the Supplier Excellence Award. We are proud of our long, successful partnership and look forward to supporting ADI's future business requirements."

"We congratulate STATS ChipPAC on winning the Supplier Excellence Award in the Contracted Production category. They demonstrated a benchmark level of consistency in the supply of quality products to Analog Devices throughout 2008," said Liam C. McCaffrey, Director of Purchasing, Worldwide Manufacturing for Analog Devices. "Their performance across a broad spectrum of metrics was outstanding and we appreciate the exceptional support they provided in new product introduction. It is our sincere pleasure to recognize STATS ChipPAC as a leader in contracted production."

The Analog Devices Supplier Excellence Awards are earned by meeting exacting supplier rating criteria. The award recognizes companies who differentiate themselves through consistent outstanding performance, continuous improvement, strategic contribution to Analog Devices' technology and market leadership through anticipation and delivery of cost-reduction initiatives and exemplary commitment to manufacturing and quality.

Forward-Looking Statements

Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, extent of deterioration in general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; customer credit risks; possible future application of push-down accounting; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; our ability to generate cash; potential impairment charges; availability of financing; adverse tax and other financial consequences if the South Korean taxing authorities do not agree with our interpretation of the applicable tax laws; classification of the Company as a passive foreign investment company; our ability to develop and protect our intellectual property; rescheduling or canceling of customer orders; changes in our product mix; our capacity utilization; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; shortages in supply of key components; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; changes in environmental laws and regulations; our ability to meet the applicable requirements for the termination of registration under the Exchange Act; our ability to meet specific conditions imposed for the continued listing or delisting of our ordinary shares on the Singapore Exchange Securities Trading Limited (SGX-ST); exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labor union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; and other risks described from time to time in the Company's filings with the U.S. Securities and Exchange Commission, including its annual report on Form 20-F dated March 9, 2009. You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Contact Information: Investor Relations Contact: Tham Kah Locke Vice President of Corporate Finance Tel: (65) 6824 7788 Fax: (65) 6720 7826 email: Media Contact: Lisa Lavin Deputy Director of Corporate Communications Tel: (208) 867-9859 email: