IRVINE, Calif., Oct. 20, 2009 (GLOBE NEWSWIRE) -- Microsemi Corporation (Nasdaq:MSCC) a leading manufacturer of high performance analog mixed signal integrated circuits and high reliability semiconductors, is exhibiting semiconductor solutions that include the world's thinnest bypass diodes designed for solar panel applications, and Microsemi's ultra thin power modules developed for solar inverters, at the Solar Power International 09 conference in Anaheim, California, October 27-29, the largest event of its kind in the United States.
At only 0.7mm high, Microsemi's new Schottky barrier photovoltaic bypass diodes are believed to be the thinnest in the world. Designed specifically for the solar panels used for power generation, the new 10A diodes are packaged with unique flexible copper leads having satellite-proven reliability. The new copper-leaded devices can be either solder- or weld-mounted under solar panel glass. They are designed to operate from -40 degrees centigrade to +125 degrees centigrade.
The Microsemi exhibit at Solar Power International also features the company's latest ultra thin power modules used in solar inverter applications. They stress high reliability, efficiency and noteworthy performance specifications. In addition, the Microsemi power modules' space-saving packages have been designed, tested and rated to assure that they are suitable for use in high moisture environments.
Microsemi power modules also provide solar inverter designers with the option of including the company's advanced silicon carbide components for the even higher performance characteristics available from this technology. The company is a leading developer of silicon carbide components.
To create the new bypass diodes for earthbound solar panels, Microsemi adapted technology it developed and refined for satellite applications where reliability is a must. The company is a leading supplier of high reliability semiconductors found not only in space but also in a broad range of defense, aerospace, and medical applications.
About Microsemi
Microsemi Corporation, with corporate headquarters in Irvine, California, is a leading designer, manufacturer and marketer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors. The company's semiconductors manage and control or regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.
Microsemi's products include individual components as well as integrated circuit solutions that enhance customer designs by improving performance and reliability, battery optimization, reducing size or protecting circuits. The principal markets the company serves include implanted medical, defense/aerospace and satellite, notebook computers, monitors and LCD TVs, automotive and mobile connectivity applications. More information may be obtained by contacting the company directly or by visiting its website at http://www.microsemi.com.
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"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements concerning exhibiting semiconductor solutions that include the world's thinnest bypass diodes designed for solar panel applications, and Microsemi's ultra thin power modules developed for solar inverters, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.