Contact Information: Company Contact: Haluk Oran 480.539.6889 Agency Contact: Bruce Kirkpatrick Kirkpatrick Communications 925.244.9100
Semiconductor CMP Pad Technology Company NexPlanar Opens Representative Office in Taiwan
| Source: NexPlanar
HILLSBORO, OR--(Marketwire - January 18, 2010) - In response to growing business activity in
Taiwan and in South East Asia, NexPlanar has established a representative
office in Taipei.
"We have been very pleased with the commercial acceptance of our CMP
polishing pads. In particular the customer interest and feedback on the
performance of our newly launched
Element™ line of pads has exceeded our expectations. The establishment
of the Taiwan representative office complements our established network of
distributors throughout Asia and will aid us in supporting our growing
customer base," said Haluk Oran, VP of Business Development.
About NexPlanar Corporation
NexPlanar builds the next generation of chemical mechanical planarization
(CMP) pads for the semiconductor device industry. NexPlanar uses
proprietary "nano-domain" technology that improves planarity and
across-wafer uniformity and can be utilized to customize the CMP pads for
specific applications. NexPlanar's "nano-lubricants" and patented molded
groove technologies allow for low stress CMP (required for the most
advanced CMP applications), result in an order of magnitude fewer defects,
low slurry consumption processing and lower overall cost of ownership. See
www.nexplanar.com.