What: eSilicon, along with other leading technologists, will discuss the
feasibility of stacked-die 3-D packaging for the future
When: Tuesday, February 2, 2010
10:10 - 11:40 AM
Where: DesignCon 2010
Santa Clara Convention Center
Ballroom H
Who: Moderator: Ed Sperling, Chip Design/SLD
Panelists: Rajiv Maheshwary, Synopsys
Javier DeLaCruz, eSilicon
Glenn Daves, Freescale Semiconductor
Carey Robertson, Mentor Graphics
Panel Abstract
While debate rages over when Moore's Law hits a technology wall, a few
enterprising technologists have moved beyond debate and are looking at
stacked die or 3-D packaging as the path to future functionality. And while
stacked die technology has proven feasible, it may be the business aspects
of bringing this paradigm to fruition that prove the most challenging.
Stacked die, or 3-D device technology, is the processes of integrating up
to three die within a single semiconductor package. Such an approach makes
it possible to mix and match lithographic geometries. But the question
arises: Who is going to put it all together so that all parties in the
supply chain can make money? The panel will address strategic questions
like: What pieces are missing for critical success? Who will benefit the
most from the 3-D approach? And if the companies who will benefit the most
are not paying for the required research, who will pay and what is in it
for them?
About eSilicon
eSilicon, a pioneering semiconductor Value Chain Producer (VCP), provides a
comprehensive suite of design, productization and manufacturing services,
enabling a flexible, low-cost, lower-risk path to volume chip production.
The company delivers application specific integrated circuits (ASICs) to
system original equipment manufacturers (OEMs) and fabless semiconductor
companies who serve a wide variety of markets including the consumer,
computer, communications and industrial segments. eSilicon -- Enabling Your
Silicon Success™. For more information, please visit www.esilicon.com.
eSilicon and the eSilicon logo are registered trademarks, and Enabling Your
Silicon Success is a trademark, of eSilicon Corporation. Other trademarks
are the property of their respective owners
Contact Information: For more information or to schedule a meeting with eSilicon at DesignCon, contact: Susan Cain Cain Communications 503-538-2747 Kalar Rajendiran eSilicon Corporation 408-616-4625