SUNNYVALE, CA--(Marketwire - December 6, 2010) - ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the 3D Architectures for Semiconductor Integration and Packaging Forum in Burlingame, CA, December 9-11. Dr. Nagesh Vodrahalli, vice president of technology and manufacturing at ALLVIA, will present a discussion on December 9 titled: "Silicon Interposers with TSVs and Embedded Capacitors for Advanced Logic Applications." His discussion will address:
- Drivers and status: VLSI packaging and 3D technologies
- Silicon interposer as the next logical step in the evolution of VLSI packaging
- Implementation of silicon interposers with embedded capacitors
Through-Silicon Vias/Embedded Capacitors
ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs and a full spectrum of facilities, IP and equipment. They recently announced they have integrated embedded capacitors on silicon interposers, a key interface between a silicon device and an organic substrate needed for managing high interconnect densities. Capacitance values higher than 1,500 nF/cm2 have been achieved for the embedded capacitors developed for delivering power to the devices. 3D integration with ALLVIA's through-silicon via technology allows much closer access to high value capacitors than previously possible, leading to a much higher level of electrical performance.
3D Integration & Packaging Conference
This conference series, which first appeared in 2004, has continued to provide a unique perspective of the emerging commercial opportunity in 3D integration. It combines technology and business with research developments and practical insights. The conference will be held at the Hyatt Regency San Francisco Airport Hotel in Burlingame, California, Dec. 8-10, 2010. See http://techventure.rti.org/
About ALLVIA
Located in Silicon Valley, ALLVIA is the first Through-silicon via (TSV) foundry and introduced the term "through-silicon via" in both a 1997 business plan and a January 2000 technical article. With the full spectrum of facilities, IP and equipment, ALLVIA offers services for prototyping and full volume production of both front side and back side TSVs to the MEMS and semiconductor industries as well as silicon etching, copper plating, photolithography, CMP, etc. www.allvia.com
Contact Information:
Company Contact:
ALLVIA, Inc.
657 N. Pastoria Ave.
Sunnyvale, CA 94085 USA
ph.: 408-720-3333
925.244.9100