BEVERLY, Mass., Dec. 16, 2010 (GLOBE NEWSWIRE) -- Axcelis Technologies, Inc. (Nasdaq:ACLS) today announced that its IntegraTM ES plasma dry strip system has been selected as the process tool of record by one of the world's largest semiconductor manufacturers. The company has received the first in a series of orders for the system to support the customer's 32nm and 28nm technology manufacturing capacity expansion. The orders will begin shipping in December 2010.
"The Integra ES was selected to perform photoresist strip levels over sensitive high-K and metal gate materials, after an extensive evaluation and process development program. Our customer was attracted to the device performance benefits achieved when running the resist strip processes over sensitive gate stack materials with non-oxidizing chemistries," said Bill Bintz, senior vice president of marketing for Axcelis Technologies. "Combined with the Integra ES' unique ability to execute these advanced processes in a repeatable, reliable manner, the product is ideally suited for high volume manufacturing for the most advanced IC devices."
Axcelis' dry strip cleaning product portfolio includes the Integra RS and ES systems as well as the RapidstripTM 320 and 210 systems. Together, these products deliver highly differentiated plasma cleaning technology to meet the full range of customer needs, from the highest productivity, non-oxidizing solutions for 32nm and below chip makers, to single chamber, small substrate size applications in the MEMS, LED, and packaging markets.
Axcelis Technologies, Inc. (Nasdaq:ACLS) headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation and cleaning systems. The company's Internet address is: www.axcelis.com.