SINGAPORE - 4/19/2011, UNITED STATES--(Marketwire - Apr 18, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced it is expanding its 300mm
STATS ChipPAC Expands Through Silicon Via Capabilities With Mid-End Processing
TSV Technology an Important Element of 2.5D and 3D Packaging
| Source: STATS ChipPAC