STATS ChipPAC and Nanyang Technological University Collaborate on New Innovative Packaging Technologies

SINGAPORE -- 13 AUGUST 2013, UNITED STATES--(Marketwired - Aug 12, 2013) -  STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced a collaborative partnership with Nanyang Technological University (NTU) focused on generating breakthrough innovations in next generation packaging technologies.

STATS ChipPAC and NTU will collaboratively focus on further advancement in wafer level packaging and interconnect technologies, and the acceleration of research on new materials and manufacturing processes. The partnership leverages the depth of resources in NTU's academicians and researchers, and STATS ChipPAC's experience in advanced semiconductor packaging technologies.

Based in Singapore, NTU is one of the world's fastest-rising universities, with globally acknowledged strengths in science and engineering. NTU recently ranked No. 2 amongst the world's top young universities aged 50 years and below by higher education information provider Quacquarelli Symonds (QS). NTU is also ranked among Asia's top 10 universities by QS. The university has made substantial contributions to Singapore's drive for research and innovation, as well as attracting top students and some of the world's best professors. The partnership is in full alignment with STATS ChipPAC's ongoing commitment to Singapore as the Company's global hub for advanced wafer level technology research and development (R&D), and Post Wafer fab Process (PWfP) for advanced mobile convergence devices.

"The semiconductor industry is evolving rapidly to meet the increasing device complexity and connectivity experience of today's electronic consumers. We are constantly seeking to expand our technology and manufacturing innovations in order to deliver differentiated solutions for our customers' next generation mobile convergence devices. We are excited to collaborate with NTU to harness semiconductor technologies that will drive the next generation of electronic devices," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

"NTU continues to be the choice partner for industry leading companies, a key trait of a world-class, research-intensive university. NTU has an established track record in research and development with key industry players and through such partnerships, we turn fundamental research into innovation, leading to commercialisation. NTU's collaboration with STATS ChipPAC provides a great opportunity for NTU faculty and post graduates to leverage on our strong research culture and expertise to develop advanced packaging solutions. By continuing to work in tandem with industry leaders such as STATS ChipPAC, we can continue to be an important engine for innovation in Singapore," said Dr Lim Jui, Chief Executive Officer, NTU Innovation.

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; shortages in supply of key components and disruption in supply chain; inability to consolidate our Malaysia operations into our China operations and uncertainty as to whether such plan will achieve the expected objectives and results; the amount of the business interruption insurance claim due to flooding of the Thailand Plant; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.