Designed for Big Data Applications, AMD Announces Industry's First "Supercomputing" Server Graphics Card With 12GB Memory

SUNNYVALE, CA--(Marketwired - Nov 14, 2013) -  AMD (NYSE: AMD) today announced the new AMD FirePro™ S10000 12GB Edition graphics card, designed for big data high-performance computing (HPC) workloads for single precision and double precision performance. With full support for PCI Express® 3.0 and optimized for use with the OpenCL™ compute programming language, the AMD FirePro S10000 12GB Edition GPU features ECC memory plus DirectGMA support allowing developers working with large models and assemblies to take advantage of the massively parallel processing capabilities of AMD GPUs based on the latest AMD Graphics Core Next (GCN) architecture. AMD FirePro S10000 12GB Edition GPU is slated for availability in Spring 2014.

The AMD FirePro S10000 12GB Edition graphics card is a compelling solution for a variety of scenarios:

• Compute/Visualization Server: finance, oil exploration, aeronautics and automotive, design and engineering, geophysics, life sciences, medicine and defense
• Double precision: genetic sequencing, computational fluid dynamics, structural mechanics, numeral analytics, reservoir simulation, automated reasoning and weather forecasting
• Single precision: seismic processing, molecular dynamics, satellite imaging, explicit crash test simulation, video enhancement, signal processing, video transcoding, digital rendering and medical imaging
• Ultra High-end Workstation (Requiring GPU compute and 3D graphics performance): Oil and gas, computer aided engineering

"Our compute application customers asked for a solution that offers increased memory to support larger data sets as they create new products and services," said David Cummings, senior director and general manager, Professional Graphics, AMD. "In response, we're announcing the AMD FirePro S10000 12GB Edition graphics card to meet that additional memory demand with support for OpenCL and high-end compute and graphics technologies."

"AMD is proving again to be a key player in providing outstanding 3D graphics and GPGPU compute solutions based on the OpenCL Khronos Group standard for the industry with the announcement of the new AMD FirePro S10000 12GB graphics card," said Nicolas Duny, VP R&D Technologies, Dassault Systèmes. "AMD is an industry innovator by responding to our customers' needs with cutting edge technology. The AMD FirePro S10000 12GB card will be a welcome addition to the market and to our customers."

"Our customers are always eager for additional memory, so the introduction of the AMD FirePro S10000 12GB Edition graphics card means key applications will finally be able to take advantage of the graphics compute capabilities," said Laurent Bertaux, CEO, CAPS. "As a leading provider of software and solutions for the HPC community, CAPS recognizes that this is a great opportunity for customers to reduce the potential for the bottleneck of data transfer, thus improving overall application performance. CAPS is a long-time AMD supporter so we're pleased that CAPS FORTAN and C compilers for OpenCL can immediately make full use of the 12GB memory offered in this new AMD FirePro solution."

The current AMD FirePro™ S10000 graphics solution with 6GB of GDDR5 memory has received great acclaim. For example, the University of Frankfurt's Institution of Advanced Studies use of the card with the SANAM supercomputer ranks in the top five on the Green500™ List as one of the most powerful and energy-efficient supercomputers powered by graphics processors.

The AMD FirePro™ S10000 with 6GB of memory is currently available for purchase while the AMD FirePro S10000 12GB Edition graphics card is slated for availability in Spring 2014.

Please visit AMD at Supercomputing 13, booth #1113, to see the AMD FirePro S10000 12GB for the latest in GPU compute technology.

Supporting Resources

• Learn more about AMD FirePro
• Learn more about AMD FirePro S-series
• Learn more about AMD and OpenCL
• Become a fan of AMD on Facebook
• Follow AMD professional graphics on Twitter @AMDFirePro

About AMD
AMD (NYSE: AMD) designs and integrates technology that powers millions of intelligent devices, including personal computers, tablets, game consoles and cloud servers that define the new era of surround computing. AMD solutions enable people everywhere to realize the full potential of their favorite devices and applications to push the boundaries of what is possible. For more information, visit www.amd.com.

AMD, the AMD Arrow logo and Radeon are trademarks of Advanced Micro Devices, Inc. OpenCL is a trademark of Apple, Inc. and used by permission of Khronos. Other names are for informational purposes only and may be trademarks of their respective owners.

This Press Release contains forward-looking statements concerning Advanced Micro Devices, Inc. ("AMD" or the "Company") including, among other things, AMD's server graphics product including strategy, the timing, availability, features and functionality of such future products, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this announcement and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that Intel Corporation's pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the Company's plans; that the Company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that customers stop buying the Company's products or materially reduce their operations or demand for its products; that the Company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company's third-party foundry suppliers will be unable to transition the Company's products to advanced manufacturing process technologies in a timely and effective way or to manufacture the Company's products on a timely basis in sufficient quantities and using competitive process technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize the Company's projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities; that the Company's requirements for wafers will be less than the fixed number of wafers that we agreed to purchase from GF or GF encounters problems that significantly reduce the number of functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that the Company is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of the Company's products; that the Company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in market growth and demand for the Company's products and technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions, including consumer PC market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or internationally, on our sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 28, 2013.