Open-Silicon Shows Innovative Solutions at TSMC Open Innovation Platform(R) Ecosystem Forum, 2015

MILPITAS, CA--(Marketwired - September 16, 2015) - Open-Silicon, a system optimized ASIC solution provider, announced today it will demonstrate the company's Industrial IoT ASIC Platform, 28Gbps SerDes Evaluation Platform, and HMC 2.0 Memory Controller IP at TSMC OIP (Sept 17th, 2015 -- Santa Clara, CA). Open-Silicon will also present a paper on innovative solutions to bump routing for SoC designs with flip chip.

What:

Demos:

1. Industrial IoT ASIC Platform -- This demonstrates end-to-end wireless communication between sensor hubs and cloud platform through a gateway device. The Industrial IoT system setup which features hardware accelerated security solution is a part of Open-Silicon's Spec2Chip IoT Platform, which allows IoT ASIC designs to be evaluated at system level.

2. 28G SerDes Evaluation Platform -- This evaluation platform for ASIC development will enable the rapid deployment of chips and systems for high bandwidth networks. The platform includes a full board with packaged TSMC 28nm test chip, software and characterization data. The chip integrates a 28Gbps SerDes quad macro, using physical layer (PHY) IP and meets the compliance needs of the CEI-28G-VSR, CEI-25-LR and CEI-28G-SR specifications.

3. HMC 2.0 Memory Controller ASIC IP -- This IP demo will showcase a platform based on Xilinx Virtex-7 XC7VX690T FPGA that includes a fully validated design that integrates HMC controller along with HMC exerciser functions. The demo platform allows quick evaluation of the HMC technology and performance testing of the HMC links.

When: 9/17/2015 (Thursday) 8 AM to 6 PM
Where: Exhibit Floor, Booth # 302, VCA Zone, Santa Clara Convention Center, CA

Presentation:

Advanced Bump Routing Methodology for SoC Designs with flip chip
Speaker: Raghuram Jambunathan -- Architect, Silicon Engineering
Session time: 9/17/2015 3:30 P.M

About Open-Silicon
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers' products by innovating at every stage of design -- architecture, logic, physical, system, software, and IP -- and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing, and test capabilities. The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300 designs and shipped over 100 million ASICs to date. Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world. www.open-silicon.com

Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders.