SANTA CLARA, Calif., Sept. 11, 2017 (GLOBE NEWSWIRE) --
WHO: Kilopass Technology, Inc., the leading provider of semiconductor embedded non-volatile memory (eNVM) intellectual property (IP) will exhibit at the Open Innovation Platform Ecosystem Forum in Booth #804.
WHAT: Learn about Kilopass antifuse eNVM IP enabled in TSMC 55LP nm conforming to Automotive Electronic Council AEC-Q100 standard to serve in a high-volume tire pressure sensor (TPS) sensor SoC. Learn more by attending “Automotive OTP NVM in TSMC Advanced Process Nodes,” by Kilopass presenter Wei Cong.
WHEN: Exhibition on September 13, 2017, from 8 a.m. until 6:30 p.m.; Wei Cong Presentation: “Automotive OTP NVM in TSMC Advanced Process Nodes” at 2:00 PM September 13, 2017 in the IP/EDA/Services Track.
WHERE: Booth #804, Santa Clara Convention Center, 5001 Great America Pkwy, Santa Clara, Calif. 95054.
For more information about Kilopass and its eNVM IP, visit: www.kilopass.com
Click to learn more about 2017 TSMC NA Technology Symposium.
About Kilopass
Kilopass Technology, Inc., is the leader in embedded non-volatile memory (NVM) intellectual property (IP). Its patented technologies of one-time programmable (OTP) NVM solutions have boundless capacity to scale to advanced CMOS process geometries. They are portable to every major foundry and integrated device manufacturer (IDM), and meet market demands for increased integration, higher densities, lower cost, low-power management, better reliability and improved security. Trusted by today's best-known brands, Kilopass' technology has been integrated by more than 170 customers, with 10-billion units shipped in over 400 industrial, automotive, consumer electronics, mobile, analog and mixed-signal, and internet of things (IoT) chip designs. For more information, visit www.kilopass.com or email info@kilopass.com.
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For more information, contact:
Jonah McLeod
Kilopass Technology
(408) 709-2828
j.mcleod@kilopass.com