SAN CARLOS, Calif., Nov. 12, 2018 (GLOBE NEWSWIRE) -- Alliance Memory today announced its technology lineup for electronica 2018, taking place Nov. 13-16 at the Munich Trade Fair Centre in Munich, Germany. In Booth B5.526, the company will be highlighting its new family of high-speed CMOS pseudo SRAMs (PSRAMs) and the latest additions to its portfolio of mobile low-power SDRAMs, including SDR (LPSDR), double data rate (LPDDR), and DDR2 (LPDDR2) devices. The company will also showcase its offering of discontinued Cypress Semiconductor Corporation CY62256 low-power SRAMs.
At electronica 2018, Alliance Memory will highlight PSRAMs with densities from 8Mb to 128Mb in 6.0 mm x 7.0 mm x 1.0 mm 48-ball FPBGA and 4.0 mm by 4.0 mm by 1.0 mm 49-ball FPBGA packages. Combining the most desirable features of SRAMs and DRAMs to provide designers with easy-to-use, low-power, and cost-effective memory solutions, the devices offer industrial temperature ranges and fast access speeds of 70s, and operate from a single power supply of 1.7V to 1.95V or 2.6V to 3.3V. Power-saving features include auto temperature-compensated self-refresh (ATCSR), partial array self-refresh (PASR), and a deep power down (DPD) mode.
Alliance Memory will showcase LPSDR SDRAMs, which extend battery life in mobile devices by offering power consumption of 1.8 V and densities of 128Mb, 256Mb, and 512Mb in 54-ball and 90-ball FBGA packages. Highlighted LPDDR devices will feature power consumption from 1.7V to 1.95V and densities of 256Mb, 512Mb, 1Gb, and 2Gb in the 60-ball and 90-ball FBGA packages. Enabling ultra-slim designs, LPDDR2 SDRAMs on display will offer power consumption of 1.2V/1.8V and densities of 1Gb, 2Gb, and 4Gb in the 134-ball FBGA package.
Alliance Memory is collaborating with Cypress Semiconductor Corporation to help ensure ongoing availability of some of the CY62256 series 32k x 8 SRAMs, offering them with their original part numbers into 2019. The company will showcase its offering at electronica 2018 in addition to its own direct replacement for the device: the AS6C62256 family.
Alliance Memory’s ICs provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions in industrial, automotive, medical, communications, telecom, and consumer electronics products requiring high memory bandwidth, and they are particularly well-suited to high performance in PC applications. The devices eliminate costly redesigns by providing long-term support for end-of-life (EOL) components. In addition, the company performs minimal or no die shrinks, which frees up engineering resources.
electronica is the world’s leading trade fair for components, systems, and applications. More information on the event is available at http://www.electronica.de/.
About Alliance Memory Inc.
Alliance Memory is a worldwide provider of critical and hard-to-find DRAM and SRAM memory ICs for the communications, computing, consumer electronics, medical, automotive, and industrial markets. The company’s product range includes DRAMs and SRAMs with commercial, industrial, and automotive operating temperature ranges and densities from 64Kb to 8Gb. Privately held, Alliance Memory maintains headquarters in San Carlos, California, and regional offices in Canada, Europe, Asia, and South America. More information about Alliance Memory is available online at www.alliancememory.com.
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https://www.alliancememory.com/visit-alliance-memory-at-electronica-2018/
| Agency Contact: Bob Decker Redpines +1 415 409 0233 bob.decker@redpinesgroup.com | Alliance Memory Contact: Kim Bagby CFO +1 650 610 6800 kim@alliancememory.com |