NEWARK, Del, March 08, 2023 (GLOBE NEWSWIRE) -- The global advanced packaging market is anticipated to be valued at US$ 30.5 billion in 2023 and reach US$ 61.3 billion by 2033. It is likely to exhibit a considerable CAGR of 7.2% between 2023 and 2033.
Advanced packaging technology has transformed in order to lower associated costs, increase integrated circuit throughput, and enhance overall performance. Due to increasing use of semiconductor integrated circuits in automobiles, there has been a considerable surge in terms of demand for sophisticated packaging in the last five years.
Massive system-on-chip solutions would support a high density as packing technology advances. The semiconductor industry has created a new set of solutions known as advanced packaging as a result of increasing focus on wafer-level packages and heterogeneous integrations.
Advanced semiconductor packaging is rapidly gaining ground on conventional semiconductor packaging all around the world. Electronics device miniaturization is boosting global sales of sophisticated packaging.
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Micro-electromechanical systems (MEMS) are expected to be widely used, which will further drive demand for embedded die packaging solutions. The technology is not new, but owing to its high cost and low yield, it has been tailored for certain uses.
Key Takeaways from the Advanced Packaging Market Study
- In terms of end user, the consumer electronics segment is set to dominate by exhibiting around 7.0% CAGR from 2023 to 2033.
- The USA advanced packaging industry is projected to create an absolute dollar opportunity of US$ 4.7 billion through 2033.
- South Korea advanced packaging market is expected to be worth US$ 3.7 billion by 2033.
- China advanced packaging market is likely to be worth US$ 15.5 billion by 2033.
- The United Kingdom advanced packaging market is estimated to showcase a CAGR of 5.6% between 2023 and 2033.
“Electronic device performance has constantly been sought for a variety of applications, including industrial, automotive, consumer, and mobile ones. Key companies are projected to develop all integrated circuit packaging, including fan-out wafer-level packages (FOWLP), with the help of special electronic solutions such as insulators and conductors,” says a lead analyst at Future Market Insights.
Competitive Landscape: Advanced Packaging Market
Due to the demand for cutting-edge technology and quick-responding devices, renowned companies are set to dominate the global advanced packaging market. These businesses continue to have a competitive advantage in the market owing to the elevated need for distinctive solutions for various applications.
The industry is further anticipated to gain traction from continuous developments in technology such as wireless communications, tablets, and smartphones.
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- China Wafer Level CSP Co. Ltd.
- ChipMOS Technologies Inc.
- FlipChip International LLC
- HANA Micron Inc.
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- King Yuan Electronics Corp.
- Nepes Corporation
- Powertech Technology Inc.
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Get More Valuable Insights into Advanced Packaging Market
Future Market Insights, in its new offering, provides an unbiased analysis of the advanced packaging market presenting historical demand data (2018 to 2022) and forecast statistics for the period from 2023 to 2033.
The study incorporates compelling insights on the advanced packaging market based on type (flip chip scale package, flip chip ball grid array, wafer level chip scale package, 5D/3D, fan out wafer-level packaging), end user (consumer electronics, automotive, industrial, healthcare, aerospace & defense), and region.
Advanced Packaging Market Outlook by Category
By Type:
- Flip Chip Scale Package
- Flip Chip Ball Grid Array
- Wafer Level Chip Scale Packaging
- 5D/3D
- Fan Out Wafer-level Packaging
- Others
By End User:
- Consumer Electronics
- Healthcare
- Industrial
- Aerospace and Defense
- Automotive
- Other
By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
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Table of Content
1. Executive Summary | Advanced Packaging Market
1.1. Global Market Outlook
1.2. Demand-side Trends
1.3. Supply-side Trends
1.4. Technology Roadmap Analysis
1.5. Analysis and Recommendations
2. Market Overview
2.1. Market Coverage / Taxonomy
2.2. Market Definition / Scope / Limitations
3. Market Background
3.1. Market Dynamics
3.1.1. Drivers
3.1.2. Restraints
3.1.3. Opportunity
3.1.4. Trends
3.2. Scenario Forecast
3.2.1. Demand in Optimistic Scenario
3.2.2. Demand in Likely Scenario
3.2.3. Demand in Conservative Scenario
3.3. Opportunity Map Analysis
3.4. Investment Feasibility Matrix
3.5. PESTLE and Porter’s Analysis
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About the Technology Division at Future Market Insights
Future Market Insights' highly experienced Packaging team aids companies from all over the world with their specific business intelligence needs through professional research, actionable insights, and strategic recommendations. With a library of over a thousand research and 1 million+ data points, the team has spent over a decade analyzing the technology business across 50+ countries. From start to end, the company provides unrivalled research and consulting services. Please get in touch with us to see how we can help.
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About Future Market Insights, Inc.
Future Market Insights, Inc. is an ESOMAR-certified business consulting & market research firm, a member of the Greater New York Chamber of Commerce and is headquartered in Delaware, USA. A recipient of Clutch Leaders Award 2022 on account of high client score (4.9/5), we have been collaborating with global enterprises in their business transformation journey and helping them deliver on their business ambitions. 80% of the largest Forbes 1000 enterprises are our clients. We serve global clients across all leading & niche market segments across all major industries.
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