MELVILLE, N.Y., Oct. 04, 2024 (GLOBE NEWSWIRE) -- Canon Inc., the parent company of Canon U.S.A., Inc., a leader in digital imaging solutions, announced the release of the FPA-3030i6 i-line1 stepper, a new semiconductor lithography system for processing wafers with a diameter of 8 inches (200 mm) or smaller.
The FPA-3030i6 system employs a newly developed projection lens that works to help reduce lens aberration for high exposure dose processes2 and improve productivity by shortening exposure time.
The full release from Canon Inc. can be found here.
Optional products including a wafer handling system for special substrates are available for order to meet users’ manufacturing needs for various emerging semiconductor devices including high-power and high-efficiency devices.
The FPA-3030i6 semiconductor lithography system is designed to support a wide range of device fabrication thanks to a variety of available process options for silicon, as well as sapphire and compound semiconductor materials.
Canon will offer wafer feeding options enabling handling of substrates from 2 inches (50 mm) to 8 inches (200 mm) in diameter, as well as thick, thin and warped substrate handling.
About Canon U.S.A., Inc.
Canon U.S.A., Inc. is a leading provider of consumer, business-to-business, and industrial digital imaging solutions to the United States and to Latin America and the Caribbean markets. With approximately $29.4 billion in global revenue, its parent company, Canon Inc. as of 2023 has ranked in the top-five overall in U.S. patents granted for 38 consecutive years†. Canon U.S.A. is dedicated to its Kyosei philosophy of social and environmental responsibility. To learn more about Canon, visit us at www.usa.canon.com and connect with us on LinkedIn at https://www.linkedin.com/company/canonusa.
# # #
† Based on weekly patent counts issued by United States Patent and Trademark Office.
1 Semiconductor lithography equipment using i-line (Mercury lamp, wavelength 365 nm) light source
1 nm (nanometer) =1/1 billion meter.
2 Under Canon's standard exposure conditions
Specifications and availability subject to change without notice.
Attachment
