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March 22, 2011 08:30 ET | Source: STATS ChipPAC

STATS ChipPAC Receives Analog Devices' Supplier Excellence Award for the Third Consecutive Year

SINGAPORE -- 3/22/2011, UNITED STATES--(Marketwire - March 22, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
February 15, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Launches Enhanced Flip Chip Packaging With fcCuBE(TM) Technology

SINGAPORE -- 2/16/2011, UNITED STATES--(Marketwire - February 15, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
January 27, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Receives Best Supplier Award From Samsung for the Second Consecutive Year

SINGAPORE -- 1/28/2011, UNITED STATES--(Marketwire - January 27, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) today announced that it recently received "Best...
January 27, 2011 04:30 ET | Source: STATS ChipPAC

STATS ChipPAC Reports Fourth Quarter and Full Year 2010 Results

SINGAPORE -- 1/27/2011, UNITED STATES--(Marketwire - January 27, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
January 17, 2011 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Expands Wafer Level Package Offering With 300mm Manufacturing in Taiwan

SINGAPORE - 1/18/2011, UNITED STATES--(Marketwire - January 17, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
January 05, 2011 13:02 ET | Source: STATS ChipPAC

STATS ChipPAC Announces Pricing of US$200 Million 5.375% Senior Notes due 2016

SINGAPORE - 1/6/2011, UNITED STATES--(Marketwire - January 5, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
January 04, 2011 23:31 ET | Source: STATS ChipPAC

STATS ChipPAC Announces Proposed Offering of US$200 Million Senior Notes Due 2016

SINGAPORE -- 1/5/2011, UNITED STATES--(Marketwire - January 4, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
December 14, 2010 08:48 ET | Source: STATS ChipPAC

STATS ChipPAC and Intersil Qualify and Ramp Copper Wire Interconnect for High-End Analog and Mixed-Signal Devices

SINGAPORE - 12/14/2010, MILPITAS, CA--(Marketwire - December 14, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service...
December 13, 2010 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC Reports Over 50% Growth in Flip Chip Business With More Than 250 Million Units Shipped in 2010

SINGAPORE - 12/14/2010, UNITED STATES--(Marketwire - December 13, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
November 29, 2010 16:00 ET | Source: STATS ChipPAC

STATS ChipPAC's Copper Wire Bond Production Exceeds 100 Million Units With Rapid Volume Ramp

SINGAPORE--11/30/2010, UNITED STATES--(Marketwire - November 29, 2010) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced...