Latest News and Press Releases

Want to stay updated on the latest news?

Sign into Reader Account Create Reader Account

February 26, 2026 09:00 ET | Source: Broadcom Inc.

Broadcom Ships 3.5D Face-to-Face Compute SoC Powering AI Revolution

PALO ALTO, Calif., Feb. 26, 2026 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions,...
December 05, 2024 09:00 ET | Source: Broadcom Inc.

Broadcom Delivers Industry’s First 3.5D F2F Technology for AI XPUs

PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology,...