TSMC OIP Award for Open-Silicon HBM Paper
Open-Silicon Receives TSMC OIP Ecosystem Forum Customers’ Choice Award for Best Paper
January 16, 2018 08:00 ET | Open-Silicon
High Bandwidth Memory (HBM2) IP Subsystem Solution Validation and Interoperability with HBM2 Memory Die Stack MILPITAS, Calif., Jan. 16, 2018 (GLOBE NEWSWIRE) -- Open-Silicon, a system-optimized...
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Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution
September 12, 2017 08:00 ET | Open-Silicon
MILPITAS, CA--(Marketwired - September 12, 2017) - Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully completed silicon validation of its High Bandwidth...
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Open-Silicon Tapes Out Industry's First High Bandwidth Memory (HBM2) IP Subsystem Solution for 2.5D ASICs in 16nm FF+
September 28, 2016 08:00 ET | Open-Silicon
MILPITAS, CA--(Marketwired - September 28, 2016) - Open-Silicon, a system-optimized ASIC solution provider, today announced it has successfully taped out the industry's first High Bandwidth Memory...