[Latest] Global Lithography Equipment Market Size/Share Worth USD 49.6 Billion by 2033 at a 7.5% CAGR: Custom Market Insights (Analysis, Outlook, Leaders, Report, Trends, Forecast, Segmentation, Growth, Growth Rate, Value)
May 29, 2024 12:30 ET
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Custom Market Insights
Austin, TX, USA, May 29, 2024 (GLOBE NEWSWIRE) -- Custom Market Insights has published a new research report titled “Lithography Equipment Market Size, Trends and Insights By Technology (Mask...
[Latest] Global Advanced Chip Packaging Market Size/Share Worth USD 71.8 Billion by 2032 at a 8.2% CAGR: Custom Market Insights (Analysis, Outlook, Leaders, Report, Trends, Forecast, Segmentation, Growth, Growth Rate, Value)
July 31, 2023 13:30 ET
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Custom Market Insights
Austin, TX, USA, July 31, 2023 (GLOBE NEWSWIRE) -- Custom Market Insights has published a new research report titled “Advanced Chip Packaging Market Size, Trends and Insights By Technology (2.5D...
STATS ChipPAC's Encapsulated Wafer Level Chip Scale Package (eWLCSP) Delivers Superior Quality Benefits
July 28, 2014 16:00 ET
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STATS ChipPAC
SINGAPORE 29 JULY 2014, UNITED STATES--(Marketwired - Jul 28, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
STATS ChipPAC Introduces Robust Encapsulated Wafer Level Packaging Technology
May 27, 2014 16:00 ET
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STATS ChipPAC
SINGAPORE--28 MAY 2014, UNITED STATES--(Marketwired - May 27, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
Deca Technologies Ships 100-Millionth Wafer-Level Packaged Component
April 16, 2014 08:00 ET
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Deca Technologies
TEMPE, AZ--(Marketwired - Apr 16, 2014) - Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth...
STATS ChipPAC Introduces Breakthrough Manufacturing Method for Wafer Level Packaging
March 11, 2014 11:00 ET
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STATS ChipPAC
SINGAPORE--11 MARCH 2014, UNITED STATES--(Marketwired - Mar 11, 2014) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
STATS ChipPAC Expands in Singapore With Grand Opening of New Building
May 28, 2013 05:15 ET
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STATS ChipPAC
SINGAPORE -- 28 MAY 2013, UNITED STATES--(Marketwired - May 28, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced...
STATS ChipPAC Expands Manufacturing Presence in Singapore With a New Factory
January 05, 2012 04:00 ET
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STATS ChipPAC
SINGAPORE--05/01/2012, UNITED STATES--(Marketwire - Jan 5, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...
STATS ChipPAC Completes Expansion of 300mm Wafer Bump and WLCSP Operation in Taiwan
November 16, 2011 23:00 ET
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STATS ChipPAC
SINGAPORE--11/17/2011, UNITED STATES--(Marketwire - Nov 16, 2011) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging...