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July 14, 2008 11:09 ET | Source: Brewer Science

Brewer Science Releases a High-Temperature Ultrathin Wafer Handling Solution, WaferBOND HT-10.10 Coating

ROLLA, Mo., July 14, 2008 (PRIME NEWSWIRE) -- Brewer Science, Inc. announces the release of its second generation of spin-on polymeric temporary wafer bonding materials with superior bonded pair...