Axus Technology Delivers Industry’s Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers Axus Technology's Capstone CMP platform offers 2x higher throughput, more than 50% lower total cost per 200mm SiC wafer compared to leading competitor.

Axus Technology Receives Orders for Innovative Capstone® CMP System from World’s Top SiC Device Makers Axus Technology is seeing orders from the top SiC makers around the world for its flexible, innovative Capstone CS200 CMP platform.

Axus Technology Secures $12.5 Million in Capital Funding Axus Technology has received $12.5 million in capital funding to advance high-volume production of its CMP systems used in semiconductor manufacturing.