ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics Lancarkan 176-Lapisan PCIe® Gen 4 x4 M.2 Industri, U.2 SSD Yang Menawarkan Prestasi R/W Cemerlang, Kapasiti Tertinggi 7.68 TB
28 juin 2023 08h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics, peneraju global dalam penyelesaian storan dan ingatan khusus, memperkenalkan Siri N600 M.2 2280 dan pemacu keadaan pepejal U.2...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATPエレクトロニクス社発表 産業用176層 PCIe® Gen 4 x4 M.2, U.2 SSD: 優れたR/Wパフォーマンス、最大容量7.68TB
28 juin 2023 08h00 HE | ATP Electronics Taiwan Inc.
台湾、台北, June 28, 2023 (GLOBE NEWSWIRE) -- 特殊ストレージとメモリ・ソリューションのグローバル・リーダーである ATPエレクトロニクス社は、Gen 4 PCIe®を備えた最新の高速N601シリーズ M.2 2280およびU.2ソリッド・ステート・ドライブ(SSD)を発表しました。 NVMe™プロトコルをサポートしており、PCIe Gen 4...
ATP_Gen 4 M.2 2280 NVMe_pic3
ATP Electronics bringt industrielle 176-Layer PCIe® Gen 4 x4 M.2-/U.2-SSDs mit hervorragender Lese-/Schreibleistung und 7,68 TB Maximalkapazität auf den Markt
28 juin 2023 08h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, June 28, 2023 (GLOBE NEWSWIRE) -- ATP Electronics, der weltweit führende Anbieter von spezialisierten Speicherlösungen, stellt seine neuesten M.2 2280- und...
Global DRAM Module and Components Market
DRAM Module and Component Market by Type, End-user Industries, Memory and Geography - Global Forecast to 2027
09 mai 2022 07h03 HE | Research and Markets
Dublin, May 09, 2022 (GLOBE NEWSWIRE) -- The "DRAM Module and Component Market by Type (LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM), End-User Industries (Server, Mobile Devices, Computers, Consumer...
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
Amid Adversity in NAND Supply, ATP Launches Additional 3D TLC Product Line with Ample Supply Support
18 mars 2022 11h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 18, 2022 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, introduces its latest line of M.2 2280 NVMe solid state drives...
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Flash and XPoint Memory Applications and Market Forecasts to 2026 - End-use Markets, Shipments, Market Shares by Vendor, and More
30 sept. 2021 05h23 HE | Research and Markets
Dublin, Sept. 30, 2021 (GLOBE NEWSWIRE) -- The "Flash and XPoint Memory Applications and Markets: 2019-2026" report has been added to ResearchAndMarkets.com's offering. Flash and XPoint memory...
ATP Electronics Thermal Management Memory Solution
ATP最大3.48/8TBのストレージを備えたNVMe M.2/U.2 SSD用の銅箔、フィンタイプ・ヒートシンク/サーマルパッドを発表
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
台湾・台北, March 29, 2021 (GLOBE NEWSWIRE) -- 台湾・台北(2021年3月) – 特殊ストレージとメモリ・ソリューションの世界的リーダーであるATP Electronicsは、カスタマイズ可能な熱管理機能を備えた新しいNVMe Flashストレージ・ソリューションの発売を発表しました。...
ATP Electronics Thermal Management Memory Solution
ATP bietet NVMe M.2 / U.2 SSDs für Hochtemperaturapplikationen
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
TAIPEH, Taiwan, March 29, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, ein führender Anbieter von spezialisierten Speicherlösungen, stellt neue NVMe-Flash-Speicherlösungen mit adaptivem Wärmemanagement...
ATP Electronics Thermal Management Memory Solution
ATP présente le dissipateur thermique/tampon thermique à ailettes et feuille de cuivre pour les cartes SSD NVMe M.2/U.2 offrant jusqu'à 3,84/8 To de stockage
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taïwan, 29 mars 2021 (GLOBE NEWSWIRE) -- ATP Electronics, le leader mondial des solutions spécialisées de stockage et de mémoire, a annoncé le lancement de ses nouvelles solutions de...
ATP Electronics Thermal Management Memory Solution
ATP Introduces Copper Foil, Fin-Type Heatsink / Thermal Pad for NVMe M.2/U.2 SSDs with up to 3.84/8 TB Storage
28 mars 2021 21h00 HE | ATP Electronics Taiwan Inc.
TAIPEI, Taiwan, March 28, 2021 (GLOBE NEWSWIRE) -- ATP Electronics, the global leader in specialized storage and memory solutions, announced the launch of its new NVMe flash storage solutions with...